Device and thermal tester for thermal testing dies of an integrated circuit
AssigneeAEM Singapore Pte. Ltd.
InventorSee Jean Chan
Life of this patent
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Abstract
A device for thermal testing one or more exposed or covered dies of an integrated circuit and a thermal tester for testing one or more exposed or covered dies of an integrated circuit on a testing platform are provided. The device for thermal testing the one or more exposed or covered dies of the integrated circuit includes a pedestal and a heatlet attached to a first end of the pedestal. The heatlet includes a face comprising one or more plates. The one or more plates are configured to match a geometry of the one or more dies. The heatlet also includes heating circuitry configured in operation to heat the one or more plates of the face and sensing circuitry configured in operation to sense a temperature of the heatlet.
Claims23
A device for thermal testing one or more exposed or covered dies of an integrated circuit, comprising:
- a pedestal;
- a heatlet attached to a first end of the pedestal, the heatlet comprising:
- a face comprising one or more plates, wherein the one or more plates are configured to match a geometry of the one or more dies,
- heating circuitry comprising two or more layers of heating circuits and configured in operation to heat the one or more plates of the face, and
- sensing circuitry configured in operation to sense a temperature of the heatlet;
- and
- a plurality of clamps disposed on the pedestal for attaching the heatlet to the first end of the pedestal.
A thermal tester for testing one or more exposed or covered dies of an integrated circuit on a testing platform, comprising:
- an adapter configured to match a geometry of the testing platform;
- a heatlet attached to a first end of the adapter, the heatlet comprising:
- a face comprising one or more plates, wherein the one or more plates are configured to match a geometry of the one or more dies,
- heating circuitry comprising two or more layers of heating circuits and configured in operation to heat the one or more plates of the face, and
- sensing circuitry configured in operation to sense a temperature of the heatlet;
- a communication interface configured in operation to receive a command for thermal testing the one or more dies;
- and
- a plurality of clamps disposed on the adapter for attaching the heatlet to the first end of the adapter.
Dependencies are inferred from the claim text.