G01N 23/2251
Using incident electron beams
Official title: using incident electron beams, e.g. scanning electron microscopy [SEM]
G01N23/2251 (Using incident electron beams) appears on 1,097 US grants and 1,363 published applications in this corpus.
Search patents in G01N- Granted patents
- 1,097
- Published applications
- 1,363
- Assignees
- 436
- Inventors
- 2,787
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 0 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 1 |
| 2002 | 4 | 14 |
| 2003 | 20 | 19 |
| 2004 | 23 | 31 |
| 2005 | 19 | 22 |
| 2006 | 30 | 56 |
| 2007 | 31 | 27 |
| 2008 | 30 | 25 |
| 2009 | 24 | 29 |
| 2010 | 16 | 16 |
| 2011 | 20 | 25 |
| 2012 | 20 | 25 |
| 2013 | 28 | 29 |
| 2014 | 34 | 62 |
| 2015 | 41 | 48 |
| 2016 | 39 | 32 |
| 2017 | 52 | 57 |
| 2018 | 49 | 43 |
| 2019 | 43 | 70 |
| 2020 | 68 | 98 |
| 2021 | 67 | 100 |
| 2022 | 85 | 115 |
| 2023 | 74 | 128 |
| 2024 | 84 | 122 |
| 2025 | 81 | 103 |
| 2026 | 67 | 66 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Overlay target measurement and shift compensation in charged particle systems and related methods6 Oct 2026US 12,754,150 B2Applied Materials Israel Ltd.
- Method for processing sampled proppant during hydraulic fracturing22 Sep 2026US 12,742,385 B2Gti Energy
- Inspection system15 Sep 2026US 12,736,487 B2Hitachi High-Tech Corporation
- Wafer measurement apparatus and operating method thereof15 Sep 2026US 12,736,488 B2Samsung Electronics Co., Ltd.
- Charged particle beam device and specimen observation method15 Sep 2026US 12,738,442 B2Hitachi High-Tech Corporation
- Sample preparation system for electron microscopy8 Oct 2026US 2026/0309653 A1The Regents of the University of California
- Method for measuring defects in two-component compound wafer and apparatus thereof8 Oct 2026US 2026/0309655 A1SK Siltron Co., Ltd.
- Method and apparatus for dictionary learning and for reconstructing images using a dictionary17 Sep 2026US 2026/0276569 A1The University of Liverpool
- System and method for calibration of inspection tools17 Sep 2026US 2026/0276570 A1ASML Netherlands B. V.
- Crystal evaluation method17 Sep 2026US 2026/0282842 A1Kioxia Corporation
Most cited
By later US patents
- Wafer pattern defect detection method and apparatus therefor138US 5,576,833 AKabushiki Kaisha Toshiba · 1996
- E-beam inspection apparatus and method of using the same on various integrated circuit chips76US 9,496,119 B1PDF Solutions, Inc. · 2016
- Surface analysis method and apparatus for carrying out the same72US 5,481,109 AHitachi, Ltd. · 1996
- Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former61US 6,855,929 B2Ebara Corporation · 2005
- Sample analyzing apparatus60US 6,072,178 AHitachi, Ltd. · 2000