C25D 5/00
Electroplating characterised by the process
Official title: Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
C25D5/00 (Electroplating characterised by the process) appears on 6,403 US grants and 7,526 published applications in this corpus.
Search patents in C25D- Granted patents
- 6,403
- Published applications
- 7,526
- Assignees
- 2,692
- Inventors
- 14,791
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 54 | 0 |
| 1977 | 58 | 0 |
| 1978 | 67 | 0 |
| 1979 | 48 | 0 |
| 1980 | 50 | 0 |
| 1981 | 55 | 0 |
| 1982 | 40 | 0 |
| 1983 | 73 | 0 |
| 1984 | 75 | 0 |
| 1985 | 80 | 0 |
| 1986 | 70 | 0 |
| 1987 | 63 | 0 |
| 1988 | 39 | 0 |
| 1989 | 53 | 0 |
| 1990 | 78 | 0 |
| 1991 | 51 | 0 |
| 1992 | 47 | 0 |
| 1993 | 48 | 0 |
| 1994 | 50 | 0 |
| 1995 | 59 | 0 |
| 1996 | 44 | 0 |
| 1997 | 65 | 0 |
| 1998 | 68 | 0 |
| 1999 | 77 | 0 |
| 2000 | 91 | 0 |
| 2001 | 112 | 35 |
| 2002 | 114 | 153 |
| 2003 | 122 | 163 |
| 2004 | 122 | 284 |
| 2005 | 119 | 245 |
| 2006 | 111 | 270 |
| 2007 | 121 | 233 |
| 2008 | 106 | 235 |
| 2009 | 108 | 305 |
| 2010 | 151 | 341 |
| 2011 | 153 | 279 |
| 2012 | 164 | 322 |
| 2013 | 186 | 307 |
| 2014 | 194 | 345 |
| 2015 | 201 | 392 |
| 2016 | 243 | 466 |
| 2017 | 307 | 369 |
| 2018 | 273 | 349 |
| 2019 | 333 | 342 |
| 2020 | 297 | 350 |
| 2021 | 259 | 327 |
| 2022 | 253 | 301 |
| 2023 | 248 | 337 |
| 2024 | 272 | 349 |
| 2025 | 221 | 272 |
| 2026 | 110 | 155 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- C25D 5/02Electroplating of selected surface areas1,938
- C25D 5/48After-treatment of electroplated surfaces1,775
- C25D 5/10Electroplating with more than one layer of the same or of different1,611
- C25D 5/60Electroplating characterised by the structure or texture of the layers1,301
- C25D 5/34Pretreatment of metallic surfaces to be electroplated1,114
- C25D 5/18Electroplating using modulated, pulsed or reversing current752
- C25D 5/54Electroplating of non-metallic surfaces640
- C25D 5/08Electroplating with moving electrolyte e.g. jet electroplating562
All 17 subgroupsShow fewer
- C25D 5/627Electroplating characterised by the visual appearance of the layers511
- C25D 5/04Electroplating with moving electrodes327
- C25D 5/22Electroplating combined with mechanical treatment during the deposition136
- C25D 5/003Electroplating using gases126
- C25D 5/20Electroplating using ultrasonic waves89
- C25D 5/16Electroplating with layers of varying thickness56
- C25D 5/007Electroplating using magnetic fields51
- C25D 5/67Electroplating to repair workpiece46
- C25D 5/011Electroplating using electromagnetic wave irradiation45
Recent patents
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- Electroplated carbon fiber having electroplated layer and method for producing thereof1 Oct 2026US 2026/0297787 A1Fuji Design Co., Ltd.
- Methods for making high-density interconnects in advanced semiconductor packaging1 Oct 2026US 2026/0305374 A1Purdue Research Foundation
- Automated switching between wafer pattern specific diffusers24 Sep 2026US 2026/0286561 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Apparatus for electroplating alloy films419US 6,482,298 B1International Business Machines Corporation · 2002
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999