C25D 5/18
Electroplating using modulated, pulsed or reversing current
C25D5/18 (Electroplating using modulated, pulsed or reversing current) appears on 752 US grants and 986 published applications in this corpus.
Search patents in C25D- Granted patents
- 752
- Published applications
- 986
- Assignees
- 485
- Inventors
- 2,111
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 7 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 5 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 6 | 0 |
| 1997 | 2 | 0 |
| 1998 | 8 | 0 |
| 1999 | 8 | 0 |
| 2000 | 13 | 0 |
| 2001 | 19 | 7 |
| 2002 | 18 | 34 |
| 2003 | 22 | 39 |
| 2004 | 35 | 47 |
| 2005 | 24 | 45 |
| 2006 | 17 | 56 |
| 2007 | 13 | 30 |
| 2008 | 22 | 30 |
| 2009 | 17 | 37 |
| 2010 | 17 | 38 |
| 2011 | 21 | 37 |
| 2012 | 16 | 29 |
| 2013 | 16 | 26 |
| 2014 | 27 | 39 |
| 2015 | 19 | 38 |
| 2016 | 29 | 45 |
| 2017 | 32 | 52 |
| 2018 | 31 | 58 |
| 2019 | 49 | 42 |
| 2020 | 38 | 47 |
| 2021 | 32 | 43 |
| 2022 | 34 | 40 |
| 2023 | 34 | 47 |
| 2024 | 32 | 43 |
| 2025 | 31 | 24 |
| 2026 | 15 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Hydraulic devices including coated surfaces25 Aug 2026US 12,716,119 B2Maxterial, Inc.
- Nickel-chromium-aluminum composite by electrodeposition18 Aug 2026US 12,709,815 B2Rtx Corporation
- Composition and method embodiments for plating metal coatings21 Jul 2026US 12,686,936 B2Battelle Memorial Institute
- Preparation method of electroplated part and electroplated part2 Jun 2026US 12,644,194 B2Tyco Electronics (Shanghai) Co., Ltd.
- Methods for alkaliating roll anodes2 Jun 2026US 12,646,703 B2Nanoscale Components, Inc.
- Method for forming multi-component alloy plating film, and multi-component alloy plating film13 Aug 2026US 2026/0234827 A1Kyoto University
- Copper film13 Aug 2026US 2026/0240001 A1Nichiden Seimitsu Kogyo Co., Ltd.
- Electrodeposition using ultrashort duration pulses6 Aug 2026US 2026/0226646 A1Nanovis, LLC
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
- Pneumatic devices including surface coatings9 Jul 2026US 2026/0193747 A1Maxterial, Inc.
Most cited
By later US patents
- Copper alloy electroplating bath for microelectronic applications264US 6,319,387 B1Semitool, Inc. · 2001
- Plating apparatus and method243US 6,391,166 B1ACM Research, Inc. · 2002
- Pulse electroplating copper or copper alloys222US 5,972,192 AAdvanced Micro Devices, Inc. · 1999
- Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer203US 6,074,544 ANovellus Systems, Inc. · 2000
- Methods of and apparatus for electroplating preselected surface regions of electrical articles154US 4,466,864 AAT&T Technologies, Inc. · 1984