Preparation method of electroplated part and electroplated part
AssigneeTyco Electronics (Shanghai) Co., Ltd.
InventorsDaiqiong (Diana) Zhang, Jialin Zhang, Wenzheng Ma, Weidong Zhang, Zhongxi Huang
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Abstract
A preparation method of an electroplated part includes the steps of plating a porous metal coating layer, placing the porous metal coating layer in a graphite colloid, and depositing graphite colloidal particles into the porous metal coating layer. The porous metal coating layer is plated at or proximate an outer side of a substrate of the electroplated part. The graphite colloidal particles are deposited into pores of the porous metal coating layer from the graphite colloid to form a graphite alloy coating layer.
Claims16
A preparation method of an electroplated part, comprising:
- plating a porous metal coating layer at an outer side of a substrate of the electroplated part;
- and
- placing the porous metal coating layer in a graphite colloid for electroplating, wherein formation of the graphite colloid includes:
- obtaining a uniform and stable palladium core colloid;
- adding graphite particles into the palladium core colloid;
- and
- depositing graphite colloidal particles of the graphite colloid into pores of the porous metal coating layer to form a graphite alloy coating layer.
A preparation method of an electroplated part, comprising:
- plating a non-porous metal coating layer on an outer side of the substrate of the electroplated part;
- plating a porous metal coating layer on an outer side of the non-porous metal coating layer;
- and
- placing the porous metal coating layer in a graphite colloid for electroplating, wherein the graphite colloid is formed by:
- adding graphite particles to a stable palladium core colloid;
- and
- causing the graphite particles to fully absorb the palladium core colloid;
- and
- depositing graphite colloidal particles of the graphite colloid into pores of the porous metal coating layer to form a graphite alloy coating layer.
Dependencies are inferred from the claim text.