C25D 5/003
Electroplating using gases
Official title: {Electroplating using gases, e.g. pressure influence}
C25D5/003 (Electroplating using gases) appears on 126 US grants and 155 published applications in this corpus.
Search patents in C25D- Granted patents
- 126
- Published applications
- 155
- Assignees
- 108
- Inventors
- 397
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 1 |
| 2002 | 0 | 3 |
| 2003 | 4 | 3 |
| 2004 | 3 | 6 |
| 2005 | 2 | 7 |
| 2006 | 1 | 5 |
| 2007 | 5 | 7 |
| 2008 | 3 | 1 |
| 2009 | 1 | 5 |
| 2010 | 2 | 12 |
| 2011 | 3 | 7 |
| 2012 | 6 | 6 |
| 2013 | 4 | 11 |
| 2014 | 3 | 8 |
| 2015 | 3 | 9 |
| 2016 | 7 | 14 |
| 2017 | 9 | 3 |
| 2018 | 4 | 7 |
| 2019 | 7 | 9 |
| 2020 | 6 | 7 |
| 2021 | 4 | 2 |
| 2022 | 9 | 6 |
| 2023 | 6 | 4 |
| 2024 | 3 | 7 |
| 2025 | 3 | 3 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electrochemical devices comprising compressed gas solvent electrolytes17 Mar 2026US 12,580,228 B2The Regents of the University of California
- Film, film forming method, and surface-coated material10 Feb 2026US 12,546,022 B2Toyota Jidosha Kabushiki Kaisha
- Plating process method8 Jul 2025US 12,351,932 B2Ebara Corporation
- Electrochemical three-dimensional printing and soldering3 Jun 2025US 12,320,028 B2University of South Florida
- Electrochemical devices comprising compressed gas solvent electrolytes27 May 2025US 12,315,886 B2South 8 Technologies, Inc.
- Electrochemical Devices Comprising Compressed Gas Solvent Electrolytes25 Jun 2026US 2026/0180028 A1The Regents of the University of California
- Multifunctional Printer for Direct Printing Metals on Fabrics28 May 2026US 2026/0146385 A1University of South Florida
- Atmospheric control of enclosed electrolytic cells4 Sep 2025US 2025/0277322 A1Phoenix Tailings, Inc.
- Method and apparatus for synthesizing metal thin film for display24 Jul 2025US 2025/0236984 A1AK Technology, Inc.
- Electrochemical Devices Comprising Compressed Gas Solvent Electrolytes16 Jan 2025US 2025/0023107 A1The Regents of the University of California
Most cited
By later US patents
- Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations100US 5,883,762 A1999
- System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices73US 8,563,339 B2Cree, Inc. · 2013
- Apparatus for electroplating a semiconductor substrate62US 5,853,559 AMitsubishi Denki Kabushiki Kaisha · 1998
- Electrospray coating of objects55US 7,951,428 B2Regents of the University of Minnesota · 2011
- Electroplating apparatus52US 5,833,820 AAdvanced Micro Devices, Inc. · 1998