Plating process method

A plating method for electroplating a metal on a substrate, the plating method comprising:

• a step of supplying an anode liquid to a first region in an anode chamber separated from a cathode chamber by a membrane and including an anode and suppressing a nonionic plating additive passing through the membrane while permitting ion species containing metallic ions passing through the membrane;
• a step of guiding a part of the anode liquid supplied to the first region to a second region positioned below the membrane and above the first region to decrease a concentration of gas bubbles contained in the anode liquid in the second region below a concentration of gas bubbles contained in the anode liquid in the first region, the second region being a region below the membrane and above a second membrane disposed below the membrane, the first region being a region below the second membrane, and a lower surface of the second membrane has an inclined site inclined with respect to a horizontal direction;
• a step of discharging the anode liquid from the first region;
• a step of discharging the anode liquid from the second region;
• a step of supplying a cathode liquid to the cathode chamber in which the substrate is disposed;
• and
• a step of flowing electricity between the substrate and the anode to electroplate the metal on the substrate.