Multifunctional Printer for Direct Printing Metals on Fabrics

A method for printing electronic circuits on fabrics using a multifunctional printer system, comprising:

• generating a conductive template on a fabric by burning the fabric surface with a laser burner to create carbonized conductive patterns;
• metalizing the conductive template by applying copper using a dual-tube Hydrogen Evolution Assisted (HEA) electroplating nozzle, which dispenses and removes an electrolyte while generating hydrogen evolution at the cathode to enhance plating;
• applying an insulating material over the metalized patterns using a passivation nozzle to passivate the surface of the conductor;
• and
• dynamically adjusting the parameters of the laser burner, the HEA electroplating nozzle, and the passivation nozzle based on real-time feedback from a digital microscope integrated with the control system.

A multifunctional printer head for printing electronic circuits on fabrics, comprising:

• a laser burner for generating conductive templates by burning the fabric surface;
• a dual-tube Hydrogen Evolution Assisted (HEA) electroplating nozzle for metalizing the conductive templates with copper;
• a passivation nozzle for applying an insulating material over the metalized patterns;
• a digital microscope for capturing real-time images of the printing process;
• and
• a control system for dynamically adjusting the parameters of the laser burner, the HEA electroplating nozzle, and the passivation nozzle based on the real-time images from the digital microscope.

A method for optimizing the printing of electronic circuits on fabrics using a multifunctional printer system, comprising:

• generating a conductive template on a fabric by burning the fabric surface with a laser burner to create carbonized conductive patterns;
• metalizing the conductive template by applying copper using a dual-tube Hydrogen Evolution Assisted (HEA) electroplating nozzle, which dispenses and removes an electrolyte while generating hydrogen evolution at the cathode to enhance plating;
• applying an insulating material over the metalized patterns using a passivation nozzle to passivate the surface of the conductor;
• dynamically adjusting the parameters of the laser burner, the HEA electroplating nozzle, and the passivation nozzle based on real-time feedback from a digital microscope integrated with the control system;
• and
• performing an iterative optimization process wherein the control system adjusts the printing parameters based on the color shade of the copper detected by the digital
• microscope, correlating the shade with the resistivity of the printed copper to maintain optimal conductivity.