Apparatus for electroplating a semiconductor substrate

A method of electroplating a semiconductor substrate comprising:

• placing a semiconductor substrate on a base;
• placing a tank body on the base, sealing the tank body to the base at a first seal and sealing a peripheral portion of an upper surface of the semiconductor substrate to the tank body at a second seal to define a volume adjacent the semiconductor substrate;
• supplying an electrolyte to the volume and electroplating an electroplated layer on the upper surface of the semiconductor substrate;
• and
• sealing the volume and introducing a gas into the volume to discharge the electrolyte through an electrolyte discharge means including a discharge tube extending through a wall of the tank body to a position immediately above the semiconductor substrate within the volume.

A method of electroplating a semiconductor substrate comprising:

• placing a semiconductor substrate on a base;
• placing a tank body on the base, sealing the tank body to the base at a first seal and sealing a peripheral portion of an upper surface of the semiconductor substrate to the tank body at a second seal to define a volume adjacent the semiconductor substrate;
• supplying an electrolyte to the volume and electroplating an electroplated layer on the upper surface of the semiconductor substrate;
• and
• sucking the electrolyte from above the semiconductor substrate through an electrolyte discharge means including a discharge tube extending through a wall of the tank body to a position immediately above the semiconductor substrate within the volume.