C25D 5/08
Electroplating with moving electrolyte e.g. jet electroplating
Official title: Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)}
C25D5/08 (Electroplating with moving electrolyte e.g. jet electroplating) appears on 562 US grants and 530 published applications in this corpus.
Search patents in C25D- Granted patents
- 562
- Published applications
- 530
- Assignees
- 284
- Inventors
- 1,168
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 10 | 0 |
| 1978 | 10 | 0 |
| 1979 | 6 | 0 |
| 1980 | 8 | 0 |
| 1981 | 12 | 0 |
| 1982 | 9 | 0 |
| 1983 | 16 | 0 |
| 1984 | 9 | 0 |
| 1985 | 9 | 0 |
| 1986 | 5 | 0 |
| 1987 | 9 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 10 | 0 |
| 1998 | 6 | 0 |
| 1999 | 8 | 0 |
| 2000 | 15 | 0 |
| 2001 | 21 | 4 |
| 2002 | 12 | 23 |
| 2003 | 16 | 18 |
| 2004 | 9 | 27 |
| 2005 | 13 | 29 |
| 2006 | 6 | 17 |
| 2007 | 17 | 17 |
| 2008 | 12 | 18 |
| 2009 | 11 | 18 |
| 2010 | 12 | 18 |
| 2011 | 14 | 20 |
| 2012 | 10 | 22 |
| 2013 | 20 | 20 |
| 2014 | 10 | 23 |
| 2015 | 11 | 14 |
| 2016 | 15 | 30 |
| 2017 | 22 | 21 |
| 2018 | 18 | 15 |
| 2019 | 14 | 24 |
| 2020 | 23 | 24 |
| 2021 | 16 | 16 |
| 2022 | 22 | 23 |
| 2023 | 21 | 19 |
| 2024 | 15 | 31 |
| 2025 | 14 | 27 |
| 2026 | 7 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Jet stream type plating device1 Sep 2026US 12,723,321 B2ASKA CORPORATION Co., Ltd.
- Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate7 Jul 2026US 12,674,246 B2Lam Research Corporation
- Plating method and plating apparatus19 May 2026US 12,630,939 B2Ebara Corporation
- High-speed 3D metal printing of semiconductor metal interconnects14 Apr 2026US 12,601,080 B2Lam Research Corporation
- Method of liquid management in anode chamber and apparatus for plating17 Mar 2026US 12,577,699 B2Ebara Corporation
- Plating method and plating apparatus27 Aug 2026US 2026/0250877 A1Ebara Corporation
- High-speed 3d metal printing of semiconductor metal interconnects16 Jul 2026US 2026/0201591 A1Lam Research Corporation
- Distribution system for the simultaneous chemical and/or electrolytic surface treatment of at least two substrates16 Jul 2026US 2026/0201598 A1Lam Research Salzburg GmbH
- Plating apparatus and plating solution discharging method16 Jul 2026US 2026/0201600 A1Ebara Corporation
- Device for electrochemical surface treatment of an inner surface of a tubular member made of electrically conductive material, in particular a gun barrel, and system comprising such a device9 Jul 2026US 2026/0193806 A1Knds France Mechanics
Most cited
By later US patents
- Method for electrochemically depositing metal on a semiconductor workpiece328US 6,565,729 B2Semitool, Inc. · 2003
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Plating cell with rotary wiper and megasonic transducer282US 5,904,827 AReynolds Tech Fabricators, Inc. · 1999
- Plating apparatus and method243US 6,391,166 B1ACM Research, Inc. · 2002
- Rotary electroplating cell with controlled current distribution234US 4,304,641 AInternational Business Machines Corporation · 1981