High-speed 3D metal printing of semiconductor metal interconnects

A method for printing metal interconnects on a substrate, comprising:

• providing a work piece substrate including one or more underlying layers, a barrier/adhesion layer and a seed layer;
• providing an anode substrate including a plurality of anodes arranged on one side of the substrate, wherein the plurality of anodes are spaced from adjacent ones of the plurality of anodes by a first predetermined gap;
• arranging the anode substrate within a second predetermined gap of the work piece substrate, and wherein a ratio of the second predetermined gap to the first predetermined gap is in a range from 0.5:1 and 1.5:1;
• energizing selected ones of the plurality of anodes while electrolyte solution is supplied between the anode substrate and the work piece substrate;
• separating the anode substrate and the work piece substrate while the anode substrate and the work piece substrate remain in the electrolyte solution;
• repositioning the anode substrate and the work piece substrate by arranging the anode substrate spaced by the second predetermined gap from the work piece substrate;
• and
• energizing selected ones of the plurality of anodes while the electrolyte solution is supplied between the anode substrate and the work piece substrate.