Plating apparatus and plating solution discharging method

Abstract

An occurrence of a plating failure caused by gas bubbles generated from an anode is reduced and a structure relating to supply of a plating solution is simplified. A plating module 400 includes a plating tank 410 for housing a plating solution, an anode 430 disposed in the plating tank 410, a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, a membrane 420 partitioning an anode region 424 in which the anode 430 is disposed and a cathode region 422 in which the substrate Wf is disposed during a plating process, the membrane 420 having an inclined surface 423a opposed to the anode 430, a supply port 412 for supplying the plating solution to the anode region 424, and a gas-liquid pipe 470 having a first end portion 472 opening at proximity of an upper end of the inclined surface 423a of the membrane 420 and a second end portion 474 opening above the surface to be plated of the substrate during the plating process, the gas-liquid pipe 470 being configured to supply the plating solution supplied to the anode region 424 from the supply port 412 to the cathode region 422 via the second end portion 474.

Dependencies are inferred from the claim text.