Plating method and plating apparatus

A plating method comprising:

• supplying a plating solution to a plating tank provided with an anode and an ionically resistive element arranged above the anode and having a plurality of holes, and immersing the anode and the ionically resistive element in the plating solution;
• stirring the plating solution by driving a paddle arranged above the ionically resistive element in a state where the anode and the ionically resistive element are immersed in the plating solution;
• immersing a substrate as a cathode in the plating solution in a state where the stirring of the plating solution with the paddle is stopped;
• resuming the stirring of the plating solution with the paddle arranged above the ionically resistive element and below the substrate in a state where the substrate is immersed in the plating solution;
• and
• performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state where the stirring of the plating solution with the paddle is resumed.