Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate

An electroplating apparatus comprising:

• (a) a plating chamber configured to contain an electrolyte and an anode while electroplating metal onto a semiconductor substrate;
• (b) a substrate holder configured to hold the semiconductor substrate such that a plating face of the substrate is separated from the anode during electroplating;
• and
• (c) a shield positioned within about 10 mm of the plating face of the semiconductor substrate, wherein the shield has a grid-like shape with a plurality of regions, each region comprising at least one opening, wherein each region has a pattern of varied local resistance, and wherein the pattern of varied local resistance repeats in at least two regions.

A method of electrodepositing a metal onto a semiconductor substrate, the method comprising:

• (a) providing a semiconductor substrate having a pattern of features into an electroplating apparatus, wherein the electroplating apparatus comprises an ionically resistive ionically permeable element or a grid-like shield having a plurality of openings, wherein the ionically resistive ionically permeable element or the grid-like shield is positioned within about 10 mm of a plating face of the semiconductor substrate, and wherein the ionically resistive ionically permeable element or the grid like shield comprise a pattern correlating to the pattern of features of the semiconductor substrate;
• (b) registering orientation of the semiconductor substrate with the ionically resistive element or the grid-like shield such that the pattern of the features on the semiconductor substrate and the matching pattern of the ionically resistive element or the grid-like shield are spatially aligned;
• and
• (c) electroplating metal onto the semiconductor substrate, while maintaining the semiconductor substrate stationary or spatially aligned relative to the ionically resistive element or the grid-like shield at least during a portion of a total electroplating time.