C25D 5/20
Electroplating using ultrasonic waves
C25D5/20 (Electroplating using ultrasonic waves) appears on 89 US grants and 82 published applications in this corpus.
Search patents in C25D- Granted patents
- 89
- Published applications
- 82
- Assignees
- 78
- Inventors
- 226
- Latest grant
- 22 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 7 | 1 |
| 2002 | 6 | 3 |
| 2003 | 5 | 6 |
| 2004 | 3 | 4 |
| 2005 | 2 | 2 |
| 2006 | 2 | 1 |
| 2007 | 1 | 1 |
| 2008 | 1 | 3 |
| 2009 | 1 | 1 |
| 2010 | 2 | 8 |
| 2011 | 2 | 3 |
| 2012 | 2 | 4 |
| 2013 | 3 | 2 |
| 2014 | 1 | 2 |
| 2015 | 1 | 4 |
| 2016 | 0 | 4 |
| 2017 | 2 | 5 |
| 2018 | 4 | 7 |
| 2019 | 4 | 4 |
| 2020 | 4 | 2 |
| 2021 | 4 | 5 |
| 2022 | 1 | 3 |
| 2023 | 4 | 2 |
| 2024 | 2 | 3 |
| 2025 | 4 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Highly compact metal-CNT composites and manufacture thereof22 Jul 2025US 12,366,005 B2Luxembourg Institute of Science and Technology (List)
- Electrolytic copper foil and preparation method therefor, negative electrode plate, secondary battery, battery module, battery pack and power consuming device10 Jun 2025US 12,327,862 B2Contemporary Amperex Technology (Hong Kong) Limited
- Coating system and method for e-coating and degasification of e-coat fluid during e-coat20 May 2025US 12,305,308 B2Tesla, Inc.
- Anodizing method and manufacturing method for an anisotropic conductive member18 Feb 2025US 12,227,863 B2FUJIFILM Corporation
- Highly magnetically permeable alloy deposition method for magnetic sensors11 Jun 2024US 12,006,587 B2
- Vibration attenuation control method and apparatus for electroplating equipment, and electronic equipment16 Jul 2026US 2026/0201599 A1ACM Research (Shanghai) Inc.
- Plating device and plating formation method10 Jul 2025US 2025/0223718 A1Hitachi, Ltd.
- Film forming apparatus for metal film17 Oct 2024US 2024/0344224 A1Toyota Jidosha Kabushiki Kaisha
- Electroforming method and system19 Sep 2024US 2024/0309534 A1Unison Industries, LLC
- Highly compact metal-cnt composites and manufacture thereof19 Sep 2024US 2024/0309535 A1Luxembourg Institute of Science and Technology (List)
Most cited
By later US patents
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Plating cell with rotary wiper and megasonic transducer282US 5,904,827 AReynolds Tech Fabricators, Inc. · 1999
- Ultrasonic agitator37US 5,409,594 ADynamotive Corporation · 1995
- Plating processes utilizing high intensity acoustic beams35US 6,368,482 B1The United States of America as represented by the Administrator of the National Aeronautics and Space Administration, Washington, DC (US) · 2002