Back to results
US 2025/0223718 A1Published application
Plating device and plating formation method
AssigneeHitachi, Ltd.
InventorsToshinori KAWAMURA, Masanori MIYAGI, Masahiro ITO, Katsumi MABUCHI
Life of this patent
Estimating the term…
Abstract
A plating device of the present invention includes a cell including a porous body surrounding a metal component and impregnated with a plating solution, and a plating electrode surrounding the porous body, in which a distance between the plating electrode and a surface of the metal component is substantially uniform.
Claims11
A plating device comprising
- a cell including
- a porous body surrounding a metal component and impregnated with a plating solution, and
- a plating electrode surrounding the porous body, wherein
- a distance between the plating electrode and a surface of the metal component is substantially uniform.
1 more element
Dependencies are inferred from the claim text.