C25D 5/007
Electroplating using magnetic fields
Official title: {Electroplating using magnetic fields, e.g. magnets}
C25D5/007 (Electroplating using magnetic fields) appears on 51 US grants and 54 published applications in this corpus.
Search patents in C25D- Granted patents
- 51
- Published applications
- 54
- Assignees
- 47
- Inventors
- 150
- Latest grant
- 8 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 1 |
| 2005 | 2 | 5 |
| 2006 | 1 | 0 |
| 2007 | 1 | 2 |
| 2008 | 2 | 3 |
| 2009 | 0 | 2 |
| 2010 | 0 | 3 |
| 2011 | 1 | 3 |
| 2012 | 1 | 0 |
| 2013 | 0 | 3 |
| 2014 | 4 | 3 |
| 2015 | 2 | 4 |
| 2016 | 1 | 2 |
| 2017 | 6 | 3 |
| 2018 | 0 | 2 |
| 2019 | 2 | 2 |
| 2020 | 1 | 3 |
| 2021 | 3 | 2 |
| 2022 | 2 | 2 |
| 2023 | 2 | 6 |
| 2024 | 4 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Electroplating device and method for manufacturing plated product8 Jul 2025US 12,351,930 B2YKK Corporation
- Highly magnetically permeable alloy deposition method for magnetic sensors11 Jun 2024US 12,006,587 B2
- Method for manufacturing a package27 Feb 2024US 11,913,132 B2Advanced Semiconductor Engineering, Inc.
- Plating apparatus and film thickness measuring method for substrate20 Feb 2024US 11,906,299 B2Ebara Corporation
- Electroplating apparatus and electroplating method2 Jan 2024US 11,859,302 B2Unimicron Technology Corp.
- Electrolysis device, stirring deposition equipment, circulating deposition system and electrolysis method26 Jun 2025US 2025/0207286 A1Industrial Technology Research Institute
- Method for manufacturing a package23 Nov 2023US 2023/0374689 A1Advanced Semiconductor Engineering, Inc.
- Apparatus and method for manufacturing of steel and other support material structures with carbon capture capability and high efficiency1 Jun 2023US 2023/0167567 A1
- Method and Apparatus for The Vertical Plating of Magnetic Cores1 Jun 2023US 2023/0170139 A1Atlas Magnetics
- Plating apparatus and film thickness measuring method for substrate18 May 2023US 2023/0152077 A1Ebara Corporation
Most cited
By later US patents
- Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like103US 5,039,381 A1991
- Method and plating apparatus35US 5,332,487 ADigital Equipment Corporation · 1994
- Nanofilaments of catalytic materials for chemical process improvements29US 9,108,858 B2Louisiana Tech University Research Foundation; a division of Louisiana Tech University Foundation, Inc. · 2015
- Method for producing magnetic heads21US 4,695,351 ADigital Equipment Corporation · 1987
- Magnetic composites for improved electrolysis19US 5,871,625 AUniversity of Iowa Research Foundation · 1999