Electroplating apparatus and electroplating method

An electroplating method, comprising:

• providing an electroplating apparatus, wherein the electroplating apparatus comprises:
• an anode and a cathode;
• a power supply electrically connected to the anode and the cathode;
• a regulating plate disposed between the anode and the cathode, wherein the regulating plate comprises an insulation grid plate and a plurality of wires;
• and
• a controller electrically connected to the plurality of wires;
• fixing a substrate to be plated on the cathode, wherein the substrate to be plated comprises a dry film, the dry film has at least a first opening and a second opening, and the first opening is smaller than the second opening;
• after the power supply supplies a power, a plurality of electric lines of force moving from the anode to the cathode are formed;
• the controller controls a state of an electromagnetic field around the plurality of wires to change an incident angle of the plurality of electric lines of force passing through the regulating plate relative to the substrate to be plated, such that a number of the electric lines of force entering the first opening is less than a number of the electric lines of force entering the second opening;
• and
• forming a metal coating on the substrate to be plated.