Method for manufacturing a package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChia Chun HSU, Chin-Feng WANG
Life of this patent
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Abstract
A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.
Claims23
A method for manufacturing a package, comprising:
- generating an electric field between an anode and a cathode to electroplate a substrate;
- depositing metal on a central region of the substrate with a first deposition rate;
- depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate;
- and
- depositing metal on the central region of the substrate, with a third deposition rate lower than the first deposition rate, after generating the electric field.
-9. (canceled)
A method for manufacturing a package, comprising:
- providing a substrate between a first electrode and a second electrode in an electroplating solution;
- generating an electric field between the first electrode and the second electrode;
- and
- changing a first deposition path of portion of a plurality of metal ions of the electroplating solution from the first electrode to the substrate after generating the electric field.
-15. (canceled)
A method for manufacturing a package, comprising:
- providing a substrate in an electroplating solution;
- generating an electric field in the electroplating solution to electroplate the substrate;
- and
- non-electrically adjusting a deposition rate of a plurality of metal ions of the electroplating solution on a portion of the substrate after generating the electric field.
-20. (canceled)
Dependencies are inferred from the claim text.