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US 11,913,132 B2Granted
Method for manufacturing a package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChia Chun Hsu, Chin-Feng Wang
Life of this patent
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Abstract
A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.
Claims6
A method for manufacturing a package, comprising:
- generating an electric field between an anode and a cathode to electroplate a substrate;
- depositing metal on a central region of the substrate with a first deposition rate;
- depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate;
- providing a barrier between the anode and the substrate, wherein the barrier includes a fan;
- adjusting a projection area of the barrier on the substrate;
- and
- depositing metal on the central region of the substrate with a third deposition rate lower than the first deposition rate after generating the electric field.
4 more elements
A method for manufacturing a package, comprising:
- generating an electric field between an anode and a cathode to electroplate a substrate;
- depositing metal on a central region of the substrate with a first deposition rate;
- depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate;
- providing a barrier between the anode and the substrate;
- adjusting a projection area of the barrier on the substrate, wherein adjusting the projection area of the barrier on the substrate includes moving a fan to adjust the projection area of the fan on the substrate;
- and
- depositing metal on the central region of the substrate with a third deposition rate lower than the first deposition rate after generating the electric field.
4 more elements
A method for manufacturing a package, comprising:
- providing a substrate in an electroplating solution;
- generating an electric field in the electroplating solution to electroplate the substrate;
- and
- non-electrically adjusting a deposition rate of a plurality of metal ions of the electroplating solution on a portion of the substrate after generating the electric field, wherein non-electrically adjusting the deposition rate includes driving a barrier to bar depositing a portion of the plurality of metal ions of the electroplating on the portion of the substrate by a local flow, wherein a flowing direction of the local flow is substantially parallel with a surface of the barrier,
- wherein the local flow flows upward from a bottom of a tank accommodating the electroplating solution to drive the barrier.
2 more elements
Dependencies are inferred from the claim text.