C25D 5/22
Electroplating combined with mechanical treatment during the deposition
C25D5/22 (Electroplating combined with mechanical treatment during the deposition) appears on 136 US grants and 134 published applications in this corpus.
Search patents in C25D- Granted patents
- 136
- Published applications
- 134
- Assignees
- 46
- Inventors
- 161
- Latest grant
- 8 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 7 | 0 |
| 2001 | 3 | 4 |
| 2002 | 8 | 11 |
| 2003 | 5 | 16 |
| 2004 | 7 | 17 |
| 2005 | 14 | 9 |
| 2006 | 13 | 13 |
| 2007 | 9 | 11 |
| 2008 | 10 | 10 |
| 2009 | 6 | 3 |
| 2010 | 4 | 7 |
| 2011 | 5 | 3 |
| 2012 | 1 | 3 |
| 2013 | 6 | 2 |
| 2014 | 2 | 2 |
| 2015 | 1 | 2 |
| 2016 | 0 | 6 |
| 2017 | 5 | 2 |
| 2018 | 2 | 0 |
| 2019 | 0 | 1 |
| 2020 | 3 | 0 |
| 2021 | 2 | 1 |
| 2022 | 3 | 3 |
| 2023 | 1 | 5 |
| 2024 | 2 | 1 |
| 2025 | 2 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Electrochemical additive manufacturing method using deposition feedback control23 Jan 2024US 11,881,412 B2Fabric8Labs, Inc.
- Coatings and coated surfaces including low-surface energy inorganic particles3 Jan 2023US 11,542,621 B1Maxterial, Inc.
- Plating apparatus and plating method4 Jun 2026US 2026/0157208 A1Ebara Corporation
- Electrochemical additive manufacturing system having maskless conductive seed layer14 Aug 2025US 2025/0259857 A1Fabric8Labs, Inc.
- Electrochemical additive manufacturing system having conductive seed layer16 May 2024US 2024/0162049 A1Fabric8Labs, Inc.
- Coatings and coated surfaces including low-surface energy inorganic particles21 Sep 2023US 2023/0295827 A1Maxterial, Inc.
- Method and Apparatus for The Vertical Plating of Magnetic Cores1 Jun 2023US 2023/0170139 A1Atlas Magnetics
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B1Nutool, Inc. · 2001
- Method for electrochemical fabrication261US 6,027,630 AUniversity of Southern California · 2000
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998