Nutool, Inc.
Milpitas, CA, US· latest recorded location
Nutool, Inc. is named on 44 US grants and 25 published applications in this corpus. Its most frequent classification is H10P (Generic processes or apparatus for the manufacture or treatment of devices covered).
- Granted patents
- 44
- Published applications
- 25
- Inventors
- 17
- Granted in 2026 so far
- 0
- Most recent grant
- 23 Aug 2005
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 12 | 13 |
| 2003 | 10 | 11 |
| 2004 | 13 | 0 |
| 2005 | 5 | 0 |
By publication year.
Technology areas
Share of 69 documents
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered46
- C25DProcesses for the electrolytic or electrophoretic production of coatings38
- B24BMachines, devices, or processes for grinding or polishing34
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by25
- C25FProcesses for the electrolytic removal of materials from objects22
- B23HWorking of metal by the action of a high concentration of electric10
- Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4
- B24DTools for grinding, buffing or sharpening2
- C23FNon-mechanical removal of metallic material from surface2
- G05BControl or regulating systems in general2
Recent patents
- Method and apparatus for avoiding particle accumulation in electrodeposition23 Aug 2005US 6,932,896 B2
- Chemical mechanical polishing endpoint detection21 Jun 2005US 6,908,374 B2
- Method for electrochemically processing a workpiece15 Mar 2005US 6,867,136 B2
- Method and apparatus for filling low aspect ratio cavities with conductive material at high rate22 Feb 2005US 6,858,121 B2
- Method and apparatus for full surface electrotreating of a wafer8 Feb 2005US 6,852,208 B2
- Distributed control system for semiconductor manufacturing equipment21 Aug 2003US 2003/0155073 A1
- Advanced chemical mechanical polishing system with smart endpoint detection14 Aug 2003US 2003/0153245 A1
- Method and system to provide electroplanarization of a workpiece with a conducting material layer24 Jul 2003US 2003/0139053 A1
- Electrochemical edge and bevel cleaning process and system26 Jun 2003US 2003/0116444 A1
- Planar metal electroprocessing26 Jun 2003US 2003/0119311 A1
Most cited
By later US patents
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B12001
- Method and apparatus for plating and polishing a semiconductor substrate132US 6,328,872 B12001
- Method and apparatus for depositing and controlling the texture of a thin film113US 6,409,904 B12002
- Pad designs and structures for a versatile materials processing apparatus109US 6,413,388 B12002
- Chip interconnect and packaging deposition methods and structures105US 6,355,153 B12002