Method and apparatus for plating and polishing a semiconductor substrate

An apparatus for plating and polishing a surface of a semiconductor workpiece, comprising:

• a first chamber having a plating device for plating the surface of the workpiece;
• wherein the plating device comprises an anode plate mounted in proximity to a bottom side of the first chamber;
• a second chamber having a polishing device for polishing the surface of the workpiece;
• and
• a partition separating the first chamber from the second chamber.

An apparatus for plating and polishing a surface of a semiconductor workpiece, comprising:

• a first chamber having a plating device for plating the surface of the workpiece;
• a second chamber having a polishing device for polishing the surface of the workpiece, wherein the polishing device comprises a pad mounted on a cylindrical anode;
• and
• a partition separating the first chamber from the second chamber.

An apparatus for plating and polishing a surface of a semiconductor workpiece, comprising:

• a first chamber having a plating device for plating the surface of the workpiece;
• a second chamber having a polishing device for polishing the surface of the workpiece, wherein the polishing device comprises a chemical mechanical polishing device;
• and
• a partition separating the first chamber from the second chamber.

An apparatus for plating and polishing a surface of a semiconductor workpiece, comprising:

• a first chamber having a plating device for plating the surface of the workpiece;
• a second chamber having a polishing device for polishing the surface of the workpiece;
• a partition separating the first chamber from the second chamber;
• and
• a workpiece support adapted to support the workpiece during plating and polishing, wherein the workpiece support is adapted to rotate about a second axis and adapted to move from side to side.

An apparatus for plating and polishing a surface of a semiconductor workpiece, comprising:

• a first chamber having a plating device for plating the surface of the workpiece;
• a second chamber having a polishing device for polishing the surface of the workpiece;
• a partition separating the first chamber from the second chamber;
• and
• a rotatable workpiece support that allows for alternate plating and polishing of a portion of the workpiece by the first chamber and second chamber, respectively.