Method and apparatus for filling low aspect ratio cavities with conductive material at high rate
AssigneeNutool, Inc.
InventorBulent M. Basol
Life of this patent
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Abstract
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, using an indirect external influence, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion, thus causing greater plating of the cavity portion relative to the top portion.
Claims59
A method of plating a conductive top surface of a workpiece, the conductive top surface of the workpiece including a top portion and a cavity portion, the method comprising the steps of:
- applying, over the conductive top surface of the workpiece, an electrolyte solution with at least one additive disposed therein, the additive becoming adsorbed on the top portion and becoming adsorbed on the cavity portion;
- applying a mask in spaced relation to the top portion of the workpiece and creating a relative motion between the mask and the workpiece to remove from the top portion of the workpiece an amount of the additive previously adsorbed on the top portion through an indirect external influence;
- applying a voltage between an electrode and the conductive top surface of the workpiece;
- and
- plating the conductive top surface of the workpiece before the additive fully re-adsorbs onto the top portion and while the mask is maintained in at least the spaced relation to the top portion of the workpiece, thereby causing greater plating of the cavity portion relative to the top portion.
A method of plating a conductive top surface of a workpiece, the conductive top surface of the workpiece including a top portion and a cavity portion, the method comprising the steps of:
- applying an electrolyte solution with at least one additive disposed therein over the conductive top surface of the workpiece;
- applying a mask in spaced relation to the top portion of the workpiece;
- creating a relative motion between the mask and to the workpiece to create an effect such that the at least one additive will enhance plating on the cavity portion more than on the top portion;
- applying a voltage between an electrode and the conductive top surface of the work piece;
- and
- plating the conductive top surface of the workpiece while the effect from the step of creating the relative motion is maintained and while the mask remains moved away from the workpiece.
Dependencies are inferred from the claim text.