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US 6,409,904 B1Granted
Method and apparatus for depositing and controlling the texture of a thin film
AssigneeNutool, Inc.
InventorsCyprian Emeka Uzoh, Homayoun Talieh
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AssigneeNutool, Inc.
InventorsCyprian Emeka Uzoh, Homayoun Talieh
Estimating the term…
The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and apparatus that plates a conductive material on a workpiece surface in a “proximity” plating manner while a pad type material or other fixed feature is making contact with the workpiece surface in a “cold worked” manner. In this manner, energy stored in the cold worked regions of the plated layer is used to accelerate and enhance micro-structural recovery and growth. Thus, large grain size is obtained in the plated material at a lower annealing temperature and a shorter annealing time.
A method for altering the texture of a top portion of a conductive layer formed on a substrate, the method comprising the steps of:
A method for altering the texture of a top portion of a conductive layer formed on a seed layer on a substrate, the method comprising the steps of:
A method for altering the texture of a top portion of a conductive layer formed on a substrate, the method comprising the steps of:
Dependencies are inferred from the claim text.