Method and apparatus for electro-chemical mechanical deposition
AssigneeNutool, Inc.
InventorHomayoun Talieh
Life of this patent
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Abstract
The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.
Claims50
A method of depositing a conductive material from an electrolyte solution of a workpiece having a top surface and a cavity portion disposed on the top surface and having a conductive layer disposed on the top surface and the cavity portion of the workpiece comprising the steps of:
- applying a potential difference between the workpiece and an anode, with the workpiece being positioned in proximity to the anode, thereby causing the application of the conductive material to at least the conductive layer disposed on the cavity portion of the workpiece;
- and
- minimizing accumulation of the conductive material to the conductive layer disposed on the top surface of the workpiece by polishing the the conductive layer disposed on the top surface of the workpiece with a pad while the application of the conductive material is occurring.
A method of transferring an electrolyte solution containing a conductive material to a workpiece surface so that depositing of the conductive material can occur upon application of power, the method comprising the steps of:
- moving a pad that contacts the workpiece surface;
- and
- applying the electrolyte solution through the pad so that the electrolyte solution is in contact with the workpiece surface, thereby providing a condition suitable for depositing of the conductive material on the workpiece surface upon application of power.
A method of depositing a conductive material from an electrolyte solution on a cavity portion of a workpiece also having a top surface, the top surface and the cavity portion having a conductive layer disposed thereover, the method comprising the steps of:
- applying a second potential difference having a first polarity between the workpiece and an anode having a pad attached thereto;
- polishing the conductive layer on the top surface of the workpiece while applying the second potential difference;
- applying a first potential difference having a second polarity opposite the first polarity between the workpiece and the anode having the pad attached thereto, the workpiece being positioned in proximity to the anode, and applying the electrolyte solution to the workpiece, thereby causing the application of the conductive material to at least the cavity portion of the workpiece;
- and
- minimizing accumulation of the conductive material to the top surface of the workpiece by polishing the top surface with a pad while the application of the conductive material is occurring.
A method of depositing a conductive material onto a workpiece having a top surface and a cavity portion disposed on the top surface comprising the steps of:
- applying an electrolyte solution of the top surface and the cavity portion of the workpiece, the electrolyte solution containing the conductive material without a substantial amount slurry;
- applying a potential difference between the workpiece and an anode, with the workpiece being positioned in proximity to the anode, thereby causing the application of the conductive material to the cavity portion of the wafer;
- and
- minimizing accumulation of the conductive material to top surface of the workpiece by polishing the top surface of the workpiece with a pad while application of the conductive material is occurring.
A method of depositing a conductive material from an electrolyte solution on a workpiece having a top surface containing a top surface portion and a cavity portion comprising the steps of:
- applying an electrolyte solution through an anode and a pad attached thereto to the top surface and the cavity portion of the workpiece;
- applying a potential difference between the workpiece and the anode, with the workpiece being positioned in proximity to the anode, thereby causing the application of the conductive material to at least the cavity portion of the workpiece;
- and
- minimizing accumulation of the conductive material to top surface of the workpiece by polishing the top surface of the workpiece with the pad while the application of the conductive material is occurring.
Dependencies are inferred from the claim text.