C25D 5/60
Electroplating characterised by the structure or texture of the layers
Official title: {Electroplating characterised by the structure or texture of the layers}
C25D5/60 (Electroplating characterised by the structure or texture of the layers) appears on 1,301 US grants and 1,575 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,301
- Published applications
- 1,575
- Assignees
- 757
- Inventors
- 3,314
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 8 | 0 |
| 1978 | 11 | 0 |
| 1979 | 10 | 0 |
| 1980 | 7 | 0 |
| 1981 | 7 | 0 |
| 1982 | 6 | 0 |
| 1983 | 10 | 0 |
| 1984 | 14 | 0 |
| 1985 | 14 | 0 |
| 1986 | 11 | 0 |
| 1987 | 7 | 0 |
| 1988 | 6 | 0 |
| 1989 | 11 | 0 |
| 1990 | 11 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 9 | 0 |
| 1996 | 9 | 0 |
| 1997 | 14 | 0 |
| 1998 | 17 | 0 |
| 1999 | 19 | 0 |
| 2000 | 21 | 0 |
| 2001 | 23 | 17 |
| 2002 | 29 | 42 |
| 2003 | 30 | 38 |
| 2004 | 34 | 60 |
| 2005 | 29 | 49 |
| 2006 | 23 | 52 |
| 2007 | 24 | 41 |
| 2008 | 31 | 48 |
| 2009 | 26 | 57 |
| 2010 | 25 | 69 |
| 2011 | 26 | 57 |
| 2012 | 25 | 67 |
| 2013 | 30 | 68 |
| 2014 | 49 | 74 |
| 2015 | 49 | 91 |
| 2016 | 62 | 87 |
| 2017 | 55 | 81 |
| 2018 | 52 | 93 |
| 2019 | 79 | 79 |
| 2020 | 68 | 65 |
| 2021 | 53 | 78 |
| 2022 | 64 | 58 |
| 2023 | 50 | 73 |
| 2024 | 51 | 61 |
| 2025 | 43 | 43 |
| 2026 | 26 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Antiviral environment-friendly composite plating layer, preparation method therefor, and antiviral environment-friendly product6 Oct 2026US 12,751,456 B2Jomoo Kitchen&Bath Co., Ltd.
- Hydraulic devices including coated surfaces25 Aug 2026US 12,716,119 B2Maxterial, Inc.
- Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom25 Aug 2026US 12,716,144 B2Dupont Electronics, Inc.
- Electric contact having a multilayered coating structure14 Jul 2026US 12,683,312 B2TE Connectivity Germany GmbH
- Copper alloy film with high strength and high conductivity16 Jun 2026US 12,655,500 B2Apple Inc.
- Electro-formed metal foils10 Sep 2026US 2026/0271625 A1American Superconductor Corporation
- System for producing lithium metal batteries3 Sep 2026US 2026/0260869 A1Pure Lithium Corporation
- Copper film13 Aug 2026US 2026/0240001 A1Nichiden Seimitsu Kogyo Co., Ltd.
- Nickel-plated metal material6 Aug 2026US 2026/0226644 A1Toyo Kohan Co.Ltd
- Electrodeposition using ultrashort duration pulses6 Aug 2026US 2026/0226646 A1Nanovis, LLC
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B1Nutool, Inc. · 2001
- Method for electrochemical fabrication261US 6,027,630 AUniversity of Southern California · 2000