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US 12,716,144 B2Granted
Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom
AssigneeDupont Electronics, Inc.
InventorsShih-Ching Lin, Ya-Mei Lin
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Abstract
The present invention discloses an ultrathin copper foil without a carrier, that has an area weight of about 45 g/m2 or less; a nominal thickness of about 5.0 μm or less; a tensile strength of about 40 Kgf/mm2 or more; and a loop stiffness of 2 mN or more. Also disclosed are methods for manufacturing the present ultrathin copper foils, surface-treated ultrathin copper foils and articles made therefrom.
Claims9
An ultrathin copper foil without a carrier, characterized in that:
- the ultrathin copper foil has an area weight of 45 g/m2 or less;
- a nominal thickness of 5.0 μm or less;
- a tensile strength of 40 Kgf/mm2 or more;
- and
- a loop stiffness of 2 mN or more.
2 more elements
Dependencies are inferred from the claim text.