Electro-formed metal foils
AssigneeAmerican Superconductor Corporation
InventorCornelis Leo Hans Thieme
Life of this patent
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Abstract
A high temperature superconductor (HTS) tape is described. The HTS tape includes a HTS layer and at least one buffer layer on which the HTS layer is disposed and a substrate on which the at least on buffer layer is disposed. The substrate comprises an alloy of Ni(1-X-Y)BXCY and has an epitaxial, non-magnetic layer of the alloy having a cube texture overlying a non-epitaxial, non-textured, non-magnetic layer of the alloy, wherein B and C are selected from the group consisting of W, Mo, and Cr; and wherein X is 0.02-0.14 and Y is 0-0.14.
Claims8
A high temperature superconductor (HTS) tape, comprising:
- a HTS layer;
- at least one buffer layer on which the HTS layer is disposed;
- and
- a substrate on which the at least on buffer layer is disposed;
- the substrate comprising an alloy of Ni(1-X-Y)BXCY, the substrate having an epitaxial, non-magnetic layer of the alloy having a cube texture overlying a non-epitaxial, non-textured, non-magnetic layer of the alloy, wherein B and C are selected from the group consisting of W, Mo, and Cr;
- and wherein X is 0.02-0.14 and Y is 0-0.14.
A high temperature superconductor (HTS) tape, comprising
- a HTS layer;
- at least one buffer layer on which the HTS layer is disposed;
- and
- a substrate on which the at least on buffer layer is disposed;
- the substrate comprising an alloy of Ni(1-X-Y)BXCY, the substrate having an epitaxial, non-magnetic layer of the alloy having a cube texture overlying a non-epitaxial, non-textured, non-magnetic layer of the alloy, wherein:
- B and C are selected from the group consisting of W, Mo, and Cr;
- and wherein X is 0.02-0.14 and Y is 0-0.14;
- and
- the non-epitaxial layer has an average grain size of between 1 μm to 5 μm.
Dependencies are inferred from the claim text.