C25D 5/02
Electroplating of selected surface areas
C25D5/02 (Electroplating of selected surface areas) appears on 1,938 US grants and 2,363 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,938
- Published applications
- 2,363
- Assignees
- 1,016
- Inventors
- 4,991
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 19 | 0 |
| 1977 | 23 | 0 |
| 1978 | 22 | 0 |
| 1979 | 12 | 0 |
| 1980 | 13 | 0 |
| 1981 | 18 | 0 |
| 1982 | 12 | 0 |
| 1983 | 27 | 0 |
| 1984 | 22 | 0 |
| 1985 | 22 | 0 |
| 1986 | 20 | 0 |
| 1987 | 16 | 0 |
| 1988 | 6 | 0 |
| 1989 | 17 | 0 |
| 1990 | 16 | 0 |
| 1991 | 16 | 0 |
| 1992 | 13 | 0 |
| 1993 | 7 | 0 |
| 1994 | 11 | 0 |
| 1995 | 9 | 0 |
| 1996 | 10 | 0 |
| 1997 | 15 | 0 |
| 1998 | 12 | 0 |
| 1999 | 20 | 0 |
| 2000 | 20 | 0 |
| 2001 | 17 | 6 |
| 2002 | 23 | 35 |
| 2003 | 23 | 45 |
| 2004 | 27 | 91 |
| 2005 | 38 | 84 |
| 2006 | 34 | 84 |
| 2007 | 44 | 90 |
| 2008 | 29 | 101 |
| 2009 | 48 | 128 |
| 2010 | 69 | 117 |
| 2011 | 60 | 94 |
| 2012 | 48 | 104 |
| 2013 | 81 | 102 |
| 2014 | 80 | 126 |
| 2015 | 68 | 134 |
| 2016 | 80 | 144 |
| 2017 | 102 | 108 |
| 2018 | 98 | 91 |
| 2019 | 88 | 106 |
| 2020 | 91 | 102 |
| 2021 | 75 | 97 |
| 2022 | 71 | 85 |
| 2023 | 71 | 99 |
| 2024 | 87 | 88 |
| 2025 | 62 | 71 |
| 2026 | 26 | 31 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System for securing component for an electrically-driven process29 Sep 2026US 12,747,513 B2Chromalloy Gas Turbine Corporation
- Methods of patterning a photoresist, and related patterning systems25 Aug 2026US 12,717,239 B2Liteq B.V.
- Mesh type atomizer using porous thin film and method for manufacturing the same18 Aug 2026US 12,708,923 B2Korea Institute of Science and Technology
- Apparatus for plating and method of manufacturing apparatus for plating14 Jul 2026US 12,680,186 B2Ebara Corporation
- Low temperature hybrid bonding metallization7 Jul 2026US 12,674,244 B2APPLIED Materials.Inc.
- Methods for making high-density interconnects in advanced semiconductor packaging1 Oct 2026US 2026/0305374 A1Purdue Research Foundation
- Automated switching between wafer pattern specific diffusers24 Sep 2026US 2026/0286561 A1APPLIED Materials.Inc.
- Method for treating packaging for radioactive material against corrosion17 Sep 2026US 2026/0275561 A1Orano Nuclear Packages and Services
- Mask plate, display panel, and display device10 Sep 2026US 2026/0271399 A1Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd.
- Method for filling cobalt into through vias of a semiconductor wafer10 Sep 2026US 2026/0271691 A1City University of Hong Kong
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B1Nutool, Inc. · 2001
- Method for electrochemical fabrication261US 6,027,630 AUniversity of Southern California · 2000
- Plating apparatus and method243US 6,391,166 B1ACM Research, Inc. · 2002
- Three dimensional microfabrication by localized electrodeposition and etching232US 5,641,391 A1997