C25D 5/022
Using masking means
Official title: {using masking means}
C25D5/022 (Using masking means) appears on 945 US grants and 1,292 published applications in this corpus.
Search patents in C25D- Granted patents
- 945
- Published applications
- 1,292
- Assignees
- 574
- Inventors
- 2,627
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 8 | 0 |
| 1986 | 6 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 8 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 9 | 0 |
| 1998 | 7 | 0 |
| 1999 | 13 | 0 |
| 2000 | 8 | 0 |
| 2001 | 10 | 4 |
| 2002 | 7 | 12 |
| 2003 | 13 | 15 |
| 2004 | 12 | 47 |
| 2005 | 15 | 55 |
| 2006 | 18 | 52 |
| 2007 | 23 | 58 |
| 2008 | 17 | 53 |
| 2009 | 27 | 71 |
| 2010 | 44 | 60 |
| 2011 | 32 | 48 |
| 2012 | 22 | 45 |
| 2013 | 42 | 52 |
| 2014 | 33 | 64 |
| 2015 | 30 | 61 |
| 2016 | 42 | 82 |
| 2017 | 56 | 69 |
| 2018 | 57 | 55 |
| 2019 | 45 | 60 |
| 2020 | 62 | 57 |
| 2021 | 43 | 49 |
| 2022 | 29 | 45 |
| 2023 | 41 | 54 |
| 2024 | 51 | 56 |
| 2025 | 37 | 50 |
| 2026 | 18 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System for securing component for an electrically-driven process29 Sep 2026US 12,747,513 B2Chromalloy Gas Turbine Corporation
- Methods of patterning a photoresist, and related patterning systems25 Aug 2026US 12,717,239 B2Liteq B.V.
- Apparatus for plating and method of manufacturing apparatus for plating14 Jul 2026US 12,680,186 B2Ebara Corporation
- Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate7 Jul 2026US 12,674,246 B2Lam Research Corporation
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Methods for making high-density interconnects in advanced semiconductor packaging1 Oct 2026US 2026/0305374 A1Purdue Research Foundation
- Automated switching between wafer pattern specific diffusers24 Sep 2026US 2026/0286561 A1APPLIED Materials.Inc.
- Mask plate, display panel, and display device10 Sep 2026US 2026/0271399 A1Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd.
- Differential contrast plating for advanced packaging applications3 Sep 2026US 2026/0258571 A1Lam Research Corporation
- Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product20 Aug 2026US 2026/0244095 A1Jsr Corporation
Most cited
By later US patents
- Method for electrochemical fabrication261US 6,027,630 AUniversity of Southern California · 2000
- Process for making electroformed stents147US 6,019,784 AElectroformed Stents, Inc. · 2000
- System and method for deposition in high aspect ratio magnetic writer heads139US 8,711,518 B1Western Digital (Fremont), LLC · 2014
- Method of electro-coating a semiconductor device120US 4,507,181 AEnergy Conversion Devices, Inc. · 1985
- Method of forming an electrically conductive member98US 4,586,988 AEnergy Conversion Devices, Inc. · 1986