C25D 5/16
Electroplating with layers of varying thickness
C25D5/16 (Electroplating with layers of varying thickness) appears on 56 US grants and 78 published applications in this corpus.
Search patents in C25D- Granted patents
- 56
- Published applications
- 78
- Assignees
- 52
- Inventors
- 207
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 2 |
| 2002 | 1 | 2 |
| 2003 | 0 | 0 |
| 2004 | 2 | 1 |
| 2005 | 1 | 2 |
| 2006 | 0 | 2 |
| 2007 | 1 | 0 |
| 2008 | 1 | 0 |
| 2009 | 1 | 1 |
| 2010 | 2 | 4 |
| 2011 | 0 | 0 |
| 2012 | 1 | 2 |
| 2013 | 0 | 2 |
| 2014 | 3 | 0 |
| 2015 | 1 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 0 |
| 2019 | 0 | 2 |
| 2020 | 6 | 9 |
| 2021 | 3 | 9 |
| 2022 | 9 | 5 |
| 2023 | 5 | 7 |
| 2024 | 8 | 11 |
| 2025 | 4 | 8 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Roughened plated sheet28 Jul 2026US 12,692,616 B2Toyo Kohan Co.Ltd
- Hot-pressed member, steel sheet for hot pressing, and method for manufacturing hot-pressed member26 May 2026US 12,637,750 B2Jfe Steel Corporation
- Galvanized steel sheet7 Apr 2026US 12,595,580 B2Jfe Steel Corporation
- Articles comprising heterogeneous and thermally stable grain-refined alloys20 Jan 2026US 12,529,160 B2Integran Technologies Inc.
- Roughened copper foil, copper-cladded laminate board, and printed wiring board28 Oct 2025US 12,457,686 B2Mitsui Mining & Smelting Co., Ltd.
- Copper film13 Aug 2026US 2026/0240001 A1Nichiden Seimitsu Kogyo Co., Ltd.
- Nickel-plated metal material6 Aug 2026US 2026/0226644 A1Toyo Kohan Co.Ltd
- Composite material, composite material manufacturing method, terminal, and terminal manufacturing method30 Jul 2026US 2026/0218406 A1Dowa Metaltech Co., Ltd.
- Composite material, terminal and method for manufacturing terminal9 Apr 2026US 2026/0098354 A1Dowa Metaltech Co., Ltd.
- Heterogeneous grain-refined metallic materials19 Mar 2026US 2026/0078519 A1Integran Technologies Inc.
Most cited
By later US patents
- Resilient contact structures for interconnecting electronic devices194US 6,778,406 B2FormFactor, Inc. · 2004
- Electroplating system with shields for varying thickness profile of deposited layer169US 6,027,631 ANovellus Systems, Inc. · 2000
- Resilient contact structures formed and then attached to a substrate169US 7,225,538 B2FormFactor, Inc. · 2007
- Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures149US 6,835,898 B2FormFactor, Inc. · 2004
- Plating method and plating apparatus37US 6,375,823 B1Kabushiki Kaisha Toshiba · 2002