C25D 5/10
Electroplating with more than one layer of the same or of different
Official title: Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10)
C25D5/10 (Electroplating with more than one layer of the same or of different) appears on 1,611 US grants and 2,104 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,611
- Published applications
- 2,104
- Assignees
- 891
- Inventors
- 4,071
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 5 | 0 |
| 1978 | 7 | 0 |
| 1979 | 9 | 0 |
| 1980 | 8 | 0 |
| 1981 | 9 | 0 |
| 1982 | 10 | 0 |
| 1983 | 11 | 0 |
| 1984 | 18 | 0 |
| 1985 | 17 | 0 |
| 1986 | 21 | 0 |
| 1987 | 9 | 0 |
| 1988 | 5 | 0 |
| 1989 | 8 | 0 |
| 1990 | 22 | 0 |
| 1991 | 9 | 0 |
| 1992 | 13 | 0 |
| 1993 | 7 | 0 |
| 1994 | 12 | 0 |
| 1995 | 11 | 0 |
| 1996 | 9 | 0 |
| 1997 | 12 | 0 |
| 1998 | 13 | 0 |
| 1999 | 8 | 0 |
| 2000 | 13 | 0 |
| 2001 | 21 | 7 |
| 2002 | 23 | 37 |
| 2003 | 29 | 18 |
| 2004 | 20 | 52 |
| 2005 | 22 | 61 |
| 2006 | 25 | 63 |
| 2007 | 26 | 45 |
| 2008 | 18 | 58 |
| 2009 | 28 | 83 |
| 2010 | 27 | 79 |
| 2011 | 42 | 79 |
| 2012 | 30 | 96 |
| 2013 | 51 | 109 |
| 2014 | 49 | 96 |
| 2015 | 61 | 117 |
| 2016 | 80 | 132 |
| 2017 | 85 | 105 |
| 2018 | 67 | 111 |
| 2019 | 104 | 115 |
| 2020 | 92 | 112 |
| 2021 | 94 | 112 |
| 2022 | 81 | 84 |
| 2023 | 75 | 123 |
| 2024 | 78 | 97 |
| 2025 | 75 | 62 |
| 2026 | 34 | 51 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Antiviral environment-friendly composite plating layer, preparation method therefor, and antiviral environment-friendly product6 Oct 2026US 12,751,456 B2Jomoo Kitchen&Bath Co., Ltd.
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil8 Sep 2026US 12,729,451 B2Fukuda Metal Foil & Powder Co., Ltd.
- Hydraulic devices including coated surfaces25 Aug 2026US 12,716,119 B2Maxterial, Inc.
- Nickel-chromium-aluminum composite by electrodeposition18 Aug 2026US 12,709,815 B2Rtx Corporation
- Method and apparatus for plating metal and metal oxide layer cores28 Jul 2026US 12,692,614 B2
- Electroplated carbon fiber having electroplated layer and method for producing thereof1 Oct 2026US 2026/0297787 A1Fuji Design Co., Ltd.
- System for producing lithium metal batteries3 Sep 2026US 2026/0260869 A1Pure Lithium Corporation
- Electrical connection terminals with silver-graphite coating and method of manufacture3 Sep 2026US 2026/0261063 A1Aptiv Technologies AG
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Surface-treated steel sheet and method for manufacturing surface-treated steel sheet20 Aug 2026US 2026/0242972 A1Nippon Steel Corporation
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Apparatus for electroplating alloy films419US 6,482,298 B1International Business Machines Corporation · 2002
- Method for electrochemically depositing metal on a semiconductor workpiece328US 6,565,729 B2Semitool, Inc. · 2003
- Method for electrochemical fabrication261US 6,027,630 AUniversity of Southern California · 2000
- Method to improve planarity of electroplated copper199US 7,064,068 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2006