C25D 5/34
Pretreatment of metallic surfaces to be electroplated
C25D5/34 (Pretreatment of metallic surfaces to be electroplated) appears on 1,114 US grants and 1,425 published applications in this corpus.
Search patents in C25D- Granted patents
- 1,114
- Published applications
- 1,425
- Assignees
- 760
- Inventors
- 3,508
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 8 | 0 |
| 1978 | 25 | 0 |
| 1979 | 14 | 0 |
| 1980 | 12 | 0 |
| 1981 | 10 | 0 |
| 1982 | 8 | 0 |
| 1983 | 13 | 0 |
| 1984 | 13 | 0 |
| 1985 | 16 | 0 |
| 1986 | 13 | 0 |
| 1987 | 10 | 0 |
| 1988 | 8 | 0 |
| 1989 | 9 | 0 |
| 1990 | 15 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 9 | 0 |
| 1994 | 8 | 0 |
| 1995 | 7 | 0 |
| 1996 | 4 | 0 |
| 1997 | 8 | 0 |
| 1998 | 11 | 0 |
| 1999 | 7 | 0 |
| 2000 | 8 | 0 |
| 2001 | 9 | 3 |
| 2002 | 13 | 21 |
| 2003 | 14 | 22 |
| 2004 | 12 | 48 |
| 2005 | 19 | 32 |
| 2006 | 19 | 52 |
| 2007 | 18 | 43 |
| 2008 | 17 | 28 |
| 2009 | 12 | 46 |
| 2010 | 22 | 56 |
| 2011 | 22 | 38 |
| 2012 | 23 | 35 |
| 2013 | 19 | 55 |
| 2014 | 16 | 66 |
| 2015 | 35 | 96 |
| 2016 | 37 | 114 |
| 2017 | 75 | 92 |
| 2018 | 57 | 78 |
| 2019 | 73 | 69 |
| 2020 | 64 | 79 |
| 2021 | 49 | 63 |
| 2022 | 50 | 64 |
| 2023 | 50 | 88 |
| 2024 | 61 | 58 |
| 2025 | 50 | 45 |
| 2026 | 23 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
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- High-strength electrogalvannealed steel sheet and method for manufacturing the same6 Oct 2026US 12,753,456 B2Jfe Steel Corporation
- Fe-based electroplated steel sheet, electrodeposition-coated steel sheet, automotive part, method of producing electrodeposition-coated steel sheet, and method of producing Fe-based electroplated steel sheet1 Sep 2026US 12,723,319 B2Jfe Steel Corporation
- Hydraulic devices including coated surfaces25 Aug 2026US 12,716,119 B2Maxterial, Inc.
- Grain-oriented electrical steel sheet and method for forming insulating coating17 Sep 2026US 2026/0275529 A1Nippon Steel Corporation
- Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product20 Aug 2026US 2026/0244095 A1Jsr Corporation
- Carbon-based direct plating process13 Aug 2026US 2026/0234828 A1
- Copper film13 Aug 2026US 2026/0240001 A1Nichiden Seimitsu Kogyo Co., Ltd.
- Nickel-plated metal sheet6 Aug 2026US 2026/0225347 A1Toyo Kohan Co.Ltd
Most cited
By later US patents
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- Chip interconnect and packaging deposition methods and structures105US 6,355,153 B1Nutool, Inc. · 2002
- Method for forming plated terminations93US 7,152,291 B2AVX Corporation · 2006
- Multilayer ceramic capacitor with terminal formed by electroless plating89US 7,345,868 B2Presidio Components, Inc. · 2008