US 7,345,868 B2 · Multilayer ceramic capacitor with terminal formed by electroless plating

Abstract

A terminal to, most commonly, a ceramic capacitor, most commonly a multilayer ceramic capacitor (MLCC), is formed by electroless plating, also known as electroless deposition or simply as electrodeposition. In the MLCC having a multiple parallel interior plates brought to, and exposed at, at least one, first, surface, an electrically-conductive first-metal layer, preferably Cu, is electrolessly deposited upon this first surface directly in contact with, mechanically connected to, and electrically connected to, the edges of these interior plates. Lateral growth of the electrolessly-deposited first-metal is sufficient to span from exposed plate to exposed plate, electrically connecting the plates. One or more top layers, preferably one of Ni and one of Sn and Pb, are deposited, preferably by plating and more preferably by electrolytic plating, on top of the electrolessly-deposited Cu.

Claims25

Dependent claims

A ceramic capacitor that is multilayer comprising:

multiple interior plates that are brought to, and exposed upon, a first surface of the capacitor to provide first exposed plate edges;
an electrolessly-plated terminal on the first surface of the capacitor and adhering to the first exposed plate edges;
and
multiple stub plates that are both (i) interspersed between the multiple interior plates and (ii) extend from the first surface slightly into the ceramic of the ceramic capacitor to present at the first surface additional exposed edges of metal to which the electrolessly plated terminal is adhered;
wherein the electrolessly-plated terminal is directly in contact with, mechanically connected to, and electrically connected to, the first exposed plate edges of the multiple interior plates at the first surface,
wherein the electrolessly plated terminal is sufficiently extensive so as to electrically connect the multiple interior plates, and
wherein the separation strength of the electrolessly plated terminal from the ceramic of the ceramic capacitor is augmented by action of the additional adherence of the electrolessly plated terminal to the additional exposed edges of the stub plates.

4 more elements

A multilayer ceramic capacitor having a plurality of parallel interior plates brought to, and exposed at, at least one first surface of the capacitor to provide first exposed plate edges for purpose of electrical termination, the capacitor comprising:

a plurality of stub plates, interspersed between the plurality of interior plates but only near the at least one first surface, these stub plates extending from the first surface slightly into the ceramic of the ceramic capacitor to present at the at least one first surface additional exposed edges of metal;
and
an electrically-conductive first-metal layer electrolessly deposited upon the at least one first surface of the capacitor,
wherein the electrolessly-deposited layer is directly in contact with, mechanically connected to, and electrically connected to, the first exposed plate edges of the plurality of interior plates at the at least one first surface,
wherein the electrolessly-deposited layer is sufficiently extensive so as to span from one of the first exposed plate edges to a next adjacent one of the first exposed plate edges thus serving to electrically connect the interior plates, and
wherein the separation strength of the electrolessly-deposited layer from the ceramic of the ceramic capacitor is augmented by additional adherence of the electrolessly-deposited layer to the additional exposed edges of metal of the plurality of stub plates at the first surface.

3 more elements

Dependencies are inferred from the claim text.

Multilayer ceramic capacitor with terminal formed by electroless plating

Life of this patent

Multilayer ceramic capacitor with terminal formed by electroless plating

Life of this patent

Abstract

Claims25