C25D 5/04
Electroplating with moving electrodes
C25D5/04 (Electroplating with moving electrodes) appears on 327 US grants and 361 published applications in this corpus.
Search patents in C25D- Granted patents
- 327
- Published applications
- 361
- Assignees
- 231
- Inventors
- 826
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 0 | 0 |
| 1980 | 8 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 6 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 7 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 9 | 1 |
| 2002 | 6 | 10 |
| 2003 | 6 | 13 |
| 2004 | 5 | 17 |
| 2005 | 8 | 15 |
| 2006 | 4 | 10 |
| 2007 | 12 | 13 |
| 2008 | 5 | 13 |
| 2009 | 9 | 16 |
| 2010 | 12 | 9 |
| 2011 | 5 | 10 |
| 2012 | 10 | 12 |
| 2013 | 10 | 8 |
| 2014 | 7 | 14 |
| 2015 | 9 | 14 |
| 2016 | 9 | 32 |
| 2017 | 11 | 19 |
| 2018 | 12 | 16 |
| 2019 | 17 | 25 |
| 2020 | 11 | 10 |
| 2021 | 17 | 16 |
| 2022 | 15 | 15 |
| 2023 | 12 | 14 |
| 2024 | 15 | 15 |
| 2025 | 10 | 18 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom25 Aug 2026US 12,716,144 B2Dupont Electronics, Inc.
- Devices, systems, and methods for treatment of tubulars14 Apr 2026US 12,601,081 B1Oceanit Laboratories, Inc.
- Plating apparatus, plating method, and method for producing wire rod having the surface plated9 Sep 2025US 12,410,536 B2National Institutes for Quantum Science and Technology
- Manufacturing method and apparatus for electronic component8 Jul 2025US 12,351,934 B2Suzhou Maxwell Technologies Co., Ltd.
- Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate8 Jul 2025US 12,351,935 B2Semsysco GmbH
- Method for treating packaging for radioactive material against corrosion17 Sep 2026US 2026/0275561 A1Orano Nuclear Packages and Services
- Device for electrochemical surface treatment of an inner surface of a tubular member made of electrically conductive material, in particular a gun barrel, and system comprising such a device9 Jul 2026US 2026/0193806 A1Knds France Mechanics
- Multifunctional Printer for Direct Printing Metals on Fabrics28 May 2026US 2026/0146385 A1University of South Florida
- Method and system for electroplating uniformity5 Mar 2026US 2026/0062830 A1Atlas Magnetics
- Electroplated Part and Manufacturing Method Therefor, Fixture for Manufacturing, and Apparatus12 Feb 2026US 2026/0043165 A1Biotyx Medical (Shenzhen) Co., Ltd.
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B1Nutool, Inc. · 2001
- Three dimensional microfabrication by localized electrodeposition and etching232US 5,641,391 A1997
- Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly197US 6,143,155 ASpeedFam-IPEC Corporation · 2000
- Processes for the production of electrophoretic displays188US 7,910,175 B2E Ink Corporation · 2011