Manufacturing method and apparatus for electronic component

A manufacturing method for an electronic component which is used for plating copper grid lines on a surface of a semiconductor device, wherein the manufacturing method comprises:

• putting a semiconductor device into a cathode region (400), and driving the semiconductor device to move in the cathode region (400), at the same time, connecting line plating rollers (200) to a power source, and driving the line plating rollers (200) to rotate, so that a surface of the semiconductor device is plated with copper grid lines in a movement direction thereof by conductive parts (210) located in a circumferential direction of an outer side of each of the line plating rollers (200);
• the conductive parts (210) comprise line plating regions (202) and deplating regions (201);
• an anode (600) is disposed on outer sides of the deplating regions (201) and is electrically connected to a positive electrode of the power source by the conductive parts (210) in the deplating regions (201);
• and the cathode region (400) capable of holding the semiconductor device is disposed on outer sides of the line plating regions (202), and the semiconductor device is electrically connected to a negative electrode of the power source by the conductive parts (210) in the line plating regions (202);
• and
• the conductive parts (210) further comprise corrosion inhibition regions (203) disposed between the line plating regions (202) and the deplating regions (201);
• and
• a plurality of conductive parts (210) are sequentially disposed in the circumferential direction of the outer side of each of the line plating rollers (200), M1 conductive parts (210) are disposed in each of the deplating regions (201), M2 conductive parts (210) are disposed in each of the line plating regions (202), and M1≥M2.