Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate

A distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate, comprising:

• a distribution body, and
• a substrate holder,
• wherein the substrate holder has a substrate holder length (L) and a substrate holder width (W) and is configured to hold the substrate to be treated, wherein the distribution body comprises several openings for a process fluid and/or an electric current, wherein the openings comprise jet holes and drain holes,
• wherein the distribution body and the substrate holder are moveable relative to each other,
• wherein the distribution body has a distribution body length and a distribution body width (w), and
• wherein the distribution body length is smaller than the substrate holder length (L), wherein the distribution body comprises a front face facing towards the substrate holder and a rear face opposite the front face, the front face and the rear face forming a space in between the jet holes being provided on the front face of the distribution body, the jet holes are directing the process fluid entering the space within the distribution body from an inlet in a direction of the substrate holder,
• the drain holes being provided as through holes between the front face and the rear face and allowing the process fluid with the electric current to flow between the front face and the rear face of the distribution body.