Method and system for electroplating uniformity

Abstract

The present disclosure provides an electroplating system comprising an anode configured to move parallel to the surface of a cathode and a speed control unit operably connected to the anode and capable of varying the speed of the anode based on distance to edge regions of the cathode. The speed of the anode increases when the anode is proximate to the edge regions of the cathode to compensate for fringe deposition effects that would otherwise create non-uniform layer thickness. The anode is smaller than the cathode and moves across the cathode surface while the speed control unit adjusts movement speed to achieve uniform electroplating deposition. The system eliminates the need for masking while providing improved thickness uniformity across the deposited layer by controlling anode movement patterns that account for increased deposition rates near cathode edges.

Dependencies are inferred from the claim text.