C25D 5/06
Brush or pad plating
C25D5/06 (Brush or pad plating) appears on 161 US grants and 143 published applications in this corpus.
Search patents in C25D- Granted patents
- 161
- Published applications
- 143
- Assignees
- 100
- Inventors
- 334
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 7 | 1 |
| 2002 | 3 | 6 |
| 2003 | 6 | 11 |
| 2004 | 2 | 7 |
| 2005 | 7 | 10 |
| 2006 | 3 | 3 |
| 2007 | 7 | 5 |
| 2008 | 4 | 8 |
| 2009 | 5 | 9 |
| 2010 | 8 | 6 |
| 2011 | 2 | 3 |
| 2012 | 6 | 5 |
| 2013 | 5 | 3 |
| 2014 | 3 | 5 |
| 2015 | 4 | 8 |
| 2016 | 3 | 14 |
| 2017 | 4 | 8 |
| 2018 | 7 | 5 |
| 2019 | 10 | 5 |
| 2020 | 3 | 2 |
| 2021 | 3 | 6 |
| 2022 | 3 | 6 |
| 2023 | 5 | 1 |
| 2024 | 6 | 3 |
| 2025 | 1 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Devices, systems, and methods for treatment of tubulars14 Apr 2026US 12,601,081 B1Oceanit Laboratories, Inc.
- Manufacturing method and apparatus for electronic component8 Jul 2025US 12,351,934 B2Suzhou Maxwell Technologies Co., Ltd.
- Electrochemical treatment system12 Nov 2024US 12,139,809 B2Corrdesa, LLC
- Film forming apparatus for forming metal film and film forming method for forming metal film8 Oct 2024US 12,110,604 B2Toyota Jidosha Kabushiki Kaisha
- Film-forming metal solution and method of forming metal coating8 Oct 2024US 12,110,605 B2Toyota Jidosha Kabushiki Kaisha
- Method for treating packaging for radioactive material against corrosion17 Sep 2026US 2026/0275561 A1Orano Nuclear Packages and Services
- Electrochemical Treatment Methods11 Sep 2025US 2025/0283243 A1Corrdesa, LLC
- Copper plating additive compositions, copper plating solutions, and uses thereof10 Jul 2025US 2025/0223717 A1Jiangyin Nanopore Innovative Materials Technology Ltd.
- System for Electrochemical Treatment and Method Thereof19 Dec 2024US 2024/0417879 A1Quaker Chemical Corporation
- Manufacturing method and apparatus for electronic component1 Aug 2024US 2024/0254646 A1Suzhou Maxwell Technologies Co., Ltd.
Most cited
By later US patents
- Fabrication of semiconductor interconnect structures553US 7,172,497 B2ASM Nutool, Inc. · 2007
- Method and apparatus for electro-chemical mechanical deposition328US 6,176,992 B1Nutool, Inc. · 2001
- Method and apparatus for plating and polishing a semiconductor substrate132US 6,328,872 B1Nutool, Inc. · 2001
- Method and apparatus for depositing and controlling the texture of a thin film113US 6,409,904 B1Nutool, Inc. · 2002
- Method for planar electroplating87US 7,449,098 B1Novellus Systems, Inc. · 2008