C23C 18/1675
Process conditions
Official title: {Process conditions}
C23C18/1675 (Process conditions) appears on 327 US grants and 413 published applications in this corpus.
Search patents in C23C- Granted patents
- 327
- Published applications
- 413
- Assignees
- 218
- Inventors
- 1,006
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 9 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 6 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 8 | 0 |
| 2001 | 1 | 4 |
| 2002 | 1 | 8 |
| 2003 | 6 | 10 |
| 2004 | 9 | 27 |
| 2005 | 8 | 23 |
| 2006 | 7 | 22 |
| 2007 | 6 | 10 |
| 2008 | 6 | 13 |
| 2009 | 8 | 15 |
| 2010 | 9 | 20 |
| 2011 | 10 | 21 |
| 2012 | 11 | 8 |
| 2013 | 12 | 10 |
| 2014 | 7 | 23 |
| 2015 | 9 | 31 |
| 2016 | 16 | 29 |
| 2017 | 23 | 20 |
| 2018 | 18 | 20 |
| 2019 | 8 | 16 |
| 2020 | 17 | 14 |
| 2021 | 13 | 14 |
| 2022 | 10 | 22 |
| 2023 | 9 | 10 |
| 2024 | 7 | 16 |
| 2025 | 16 | 6 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- Method of fabricating semiconductor device using apparatus for supplying supercritical fluids2 Jun 2026US 12,644,188 B2Samsung Electronics Co., Ltd.
- In-situ fingerprinting for electrochemical deposition and/or electrochemical etching26 May 2026US 12,637,782 B2Nova Measuring Instruments Ltd.
- Method of producing catalyst, catalyst, and fuel cell23 Dec 2025US 12,506,157 B2Toyota Boshoku Kabushiki Kaisha
- Manufacturing method of rolled surface-treated steel sheet and rolled surface-treated steel sheet2 Jul 2026US 2026/0185235 A1Toyo Kohan Co.Ltd
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof20 Nov 2025US 2025/0354267 A1Zhejiang University
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser17 Jul 2025US 2025/0230549 A1Andong National University Industry-Academic Cooperation Foundation
- Method for plating edge connectors on circuit board with gold, and circuit board5 Jun 2025US 2025/0185181 A1Suzhou Metabrain Intelligent Technology Co., Ltd.
- System and method for performing localized electroless nickel plating13 Feb 2025US 2025/0051926 A1Nuovo Pignone Tecnologie Srl
Most cited
By later US patents
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Method of fabricating an interconnection element335US 6,336,269 B12002
- Electroless deposition equipment or apparatus and method of performing electroless deposition292US 5,830,805 ACornell Research Foundation, Inc. · 1998
- Method for controlling electroless magnetic plating241US 4,810,520 AMagnetic Peripherals Inc. · 1989
- Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process241US 6,616,967 B1Texas Instruments Incorporated · 2003