C23C 18/1633
Process of electroless plating
Official title: {Process of electroless plating}
C23C18/1633 (Process of electroless plating) appears on 2,251 US grants and 3,201 published applications in this corpus.
Search patents in C23C- Granted patents
- 2,251
- Published applications
- 3,201
- Assignees
- 1,313
- Inventors
- 6,573
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 5 | 0 |
| 1978 | 9 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 7 | 0 |
| 1982 | 18 | 0 |
| 1983 | 11 | 0 |
| 1984 | 10 | 0 |
| 1985 | 9 | 0 |
| 1986 | 17 | 0 |
| 1987 | 17 | 0 |
| 1988 | 11 | 0 |
| 1989 | 19 | 0 |
| 1990 | 14 | 0 |
| 1991 | 11 | 0 |
| 1992 | 6 | 0 |
| 1993 | 14 | 0 |
| 1994 | 6 | 0 |
| 1995 | 18 | 0 |
| 1996 | 23 | 0 |
| 1997 | 17 | 0 |
| 1998 | 14 | 0 |
| 1999 | 28 | 0 |
| 2000 | 35 | 0 |
| 2001 | 28 | 12 |
| 2002 | 34 | 43 |
| 2003 | 39 | 63 |
| 2004 | 51 | 103 |
| 2005 | 34 | 115 |
| 2006 | 36 | 104 |
| 2007 | 40 | 111 |
| 2008 | 25 | 109 |
| 2009 | 39 | 109 |
| 2010 | 58 | 134 |
| 2011 | 57 | 121 |
| 2012 | 78 | 121 |
| 2013 | 59 | 109 |
| 2014 | 87 | 167 |
| 2015 | 98 | 220 |
| 2016 | 105 | 260 |
| 2017 | 137 | 194 |
| 2018 | 150 | 170 |
| 2019 | 145 | 165 |
| 2020 | 120 | 169 |
| 2021 | 121 | 129 |
| 2022 | 98 | 121 |
| 2023 | 79 | 126 |
| 2024 | 79 | 104 |
| 2025 | 77 | 75 |
| 2026 | 35 | 47 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- Electroless deposition process for semiconductor devices6 Oct 2026US 12,757,651 B2
- Substrate liquid processing method, and recording medium6 Oct 2026US 12,757,697 B2Tokyo Electron Limited
- Apparatus and method for electroless surface finishing on glass15 Sep 2026US 12,740,460 B2Intel Corporation
- Hydraulic devices including coated surfaces25 Aug 2026US 12,716,119 B2Maxterial, Inc.
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Metal substrate and surface treatment method10 Sep 2026US 2026/0265919 A1National Tsing Hua University
- Laminate and method for manufacturing circuit board27 Aug 2026US 2026/0255493 A1Arisawa Mfg.Co., Ltd.
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Vacuum-integrated hardmask processes and apparatus389US 9,778,561 B2Lam Research Corporation · 2017