C23C 18/1689
After-treatment
Official title: {After-treatment}
C23C18/1689 (After-treatment) appears on 414 US grants and 637 published applications in this corpus.
Search patents in C23C- Granted patents
- 414
- Published applications
- 637
- Assignees
- 417
- Inventors
- 1,552
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 3 |
| 2002 | 4 | 1 |
| 2003 | 4 | 14 |
| 2004 | 5 | 12 |
| 2005 | 5 | 18 |
| 2006 | 4 | 15 |
| 2007 | 6 | 24 |
| 2008 | 1 | 29 |
| 2009 | 7 | 30 |
| 2010 | 9 | 22 |
| 2011 | 19 | 30 |
| 2012 | 18 | 17 |
| 2013 | 17 | 18 |
| 2014 | 16 | 31 |
| 2015 | 18 | 42 |
| 2016 | 17 | 50 |
| 2017 | 19 | 39 |
| 2018 | 36 | 37 |
| 2019 | 35 | 40 |
| 2020 | 35 | 42 |
| 2021 | 22 | 24 |
| 2022 | 15 | 34 |
| 2023 | 22 | 25 |
| 2024 | 20 | 18 |
| 2025 | 12 | 14 |
| 2026 | 9 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards25 Aug 2026US 12,716,133 B2Atotech Deutschland GmbH
- Method for blackening an electrical conduit28 Apr 2026US 12,615,011 B2Merlin Solar Technologies, Inc.
- Low friction coating for melt blown die and preparation method for coating31 Mar 2026US 12,590,037 B2Taizhou Clean Carbon Technology Co., Ltd.
- Anti-diffusion substrate structure and manufacturing method thereof3 Mar 2026US 12,568,810 B2Unimicron Technology Corp.
- Semiconductor processing station and semiconductor process using the same17 Feb 2026US 12,557,584 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Ceramic plate, package, manufacturing method for ceramic plate, module, and electric or electronic product6 Aug 2026US 2026/0225963 A1Denka Company Limited
- Manufacturing method of rolled surface-treated steel sheet and rolled surface-treated steel sheet2 Jul 2026US 2026/0185235 A1Toyo Kohan Co.Ltd
- Hard film formed body, machine component, and bearing2 Jul 2026US 2026/0185562 A1Ntn Corporation
- Wheels including a coating layer and methods for making the same25 Jun 2026US 2026/0177066 A1Garrett Transportation I Inc.
- Semi-Additive Process for Printed Circuit Boards11 Jun 2026US 2026/0164566 A1Catlam, LLC
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997