Semiconductor processing station and semiconductor process using the same

A semiconductor process using a semiconductor processing station, wherein the semiconductor processing station comprises a central transfer chamber as well as a processing module, a cooling stage and a load lock chamber surrounding the central transfer chamber, the load lock chamber comprises a cooling pipe and an external pipe, the cooling pipe is disposed in the load lock chamber and has a first segment extending along a sidewall of the load lock chamber and a second segment extending across opposite sides of the load lock chamber, the first segment is connected to an end of the second segment from below the second segment, the external pipe extends from an external fluid source to the second segment of the cooling pipe, and the semiconductor process comprises:

• performing multiple cycles, each comprising:
• providing a wafer to the processing module from the load lock chamber by an interface robot in the central transfer chamber;
• transferring the processed wafer from the processing module to the cooling stage by the interface robot, wherein the processed wafer is cooled at the cooling stage;
• and
• returning the processed wafer to the load lock chamber by using the interface robot, wherein the processed wafer is further cooled in the load lock chamber.