Use of cobalt tungsten phosphide as a barrier material for copper metallization
AssigneesCornell Research Foundation, Inc., Sematech, Inc., Intel Corporation
InventorsValery M. Dubin, Yosi Schacham-Diamand, Bin Zhao, Prahalad K. Vasudev, Chiu H. Ting
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Abstract
A technique for electrolessly depositing a CoWP barrier material on to copper and electrolessly depositing copper onto a CoWP barrier material to prevent copper diffusion when forming layers and/or structures on a semiconductor wafer.
Claims21
A method of electrolessly depositing copper onto a barrier layer which separates said copper from another layer disposed on an opposite side of said barrier layer from said copper, comprising the steps of:
- depositing cobalt-tungsten-phosphide, CoWP, electrolessly on an exposed surface of said another layer to form said barrier layer;
- depositing said copper electrolessly.
A method of electrolessly depositing a barrier layer on copper, comprising the steps of:
- depositing said copper to form a copper layer;
- depositing cobalt-tungsten-phosphide, CoWP, electrolessly on an exposed surface of said copper layer to form said barrier layer.
A method of electrolessly depositing a diffusion barrier layer on a material layer, comprising the steps of:
- activating a surface of said material layer for autocatalytic growth of cobalt-tungsten-phosphide, (CoWP), by forming an activation seed layer for CoWP on said surface of said material layer;
- depositing CoWP electrolessly on said surface of said material layer to form said diffusion barrier layer.
A method of electrolessly depositing a diffusion barrier layer on a conductive layer formed on a semiconductor wafer in order to prevent diffusion of atoms between said conductive layer and a subsequent layer deposited onto said diffusion barrier layer, comprising the steps of:
- depositing cobalt-tungsten-phosphide, CoWP, electrolessly on said conductive layer to form said diffusion barrier layer;
- depositing said subsequent layer over said diffusion barrier layer.
Dependencies are inferred from the claim text.