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US 2026/0225963 A1Published application
Ceramic plate, package, manufacturing method for ceramic plate, module, and electric or electronic product
AssigneeDenka Company Limited
InventorsDaisuke GOTO, Hiroshi ONO
Life of this patent
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Abstract
There is provided a ceramic plate including a plating film on at least a part of a surface of a plate-like ceramic member. When the ceramic plate is heated from 25° C. to 400° C. at a temperature rising rate of 5° C./min according to a temperature-programmed desorption gas analysis method, a release amount A250 of hydrogen per unit mass of the ceramic plate at 250° C. is 5.0×10−10 A/g or less in terms of a mass spectral intensity based on an ion current value.
Claims13
A ceramic plate comprising:
- a plating film on at least a part of a surface of a plate-like ceramic member,
- wherein when the ceramic plate is heated from 25° C. to 400° C. at a temperature rising rate of 5° C./min according to a temperature-programmed desorption gas analysis method, a release amount A250 of hydrogen per unit mass of the ceramic plate at 250° C. is 5.0×10−10 A/g or less in terms of a mass spectral intensity based on an ion current value.
Dependencies are inferred from the claim text.