C23C 18/1601
Process or apparatus
Official title: {Process or apparatus}
C23C18/1601 (Process or apparatus) appears on 2,823 US grants and 3,762 published applications in this corpus.
Search patents in C23C- Granted patents
- 2,823
- Published applications
- 3,762
- Assignees
- 1,469
- Inventors
- 7,623
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 19 | 0 |
| 1977 | 9 | 0 |
| 1978 | 24 | 0 |
| 1979 | 14 | 0 |
| 1980 | 11 | 0 |
| 1981 | 17 | 0 |
| 1982 | 22 | 0 |
| 1983 | 14 | 0 |
| 1984 | 16 | 0 |
| 1985 | 13 | 0 |
| 1986 | 22 | 0 |
| 1987 | 29 | 0 |
| 1988 | 20 | 0 |
| 1989 | 26 | 0 |
| 1990 | 20 | 0 |
| 1991 | 15 | 0 |
| 1992 | 19 | 0 |
| 1993 | 21 | 0 |
| 1994 | 14 | 0 |
| 1995 | 27 | 0 |
| 1996 | 29 | 0 |
| 1997 | 22 | 0 |
| 1998 | 19 | 0 |
| 1999 | 38 | 0 |
| 2000 | 43 | 0 |
| 2001 | 42 | 19 |
| 2002 | 49 | 60 |
| 2003 | 49 | 81 |
| 2004 | 68 | 129 |
| 2005 | 46 | 163 |
| 2006 | 50 | 144 |
| 2007 | 53 | 141 |
| 2008 | 39 | 130 |
| 2009 | 57 | 137 |
| 2010 | 79 | 160 |
| 2011 | 79 | 145 |
| 2012 | 95 | 146 |
| 2013 | 74 | 129 |
| 2014 | 110 | 194 |
| 2015 | 110 | 249 |
| 2016 | 132 | 308 |
| 2017 | 169 | 214 |
| 2018 | 171 | 186 |
| 2019 | 158 | 185 |
| 2020 | 132 | 193 |
| 2021 | 135 | 138 |
| 2022 | 108 | 132 |
| 2023 | 87 | 135 |
| 2024 | 85 | 109 |
| 2025 | 84 | 82 |
| 2026 | 39 | 53 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for performing localized electroless nickel plating6 Oct 2026US 12,753,513 B2Nuovo Pignone Tecnologie Srl
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- Electroless deposition process for semiconductor devices6 Oct 2026US 12,757,651 B2
- Substrate liquid processing method, and recording medium6 Oct 2026US 12,757,697 B2Tokyo Electron Limited
- Substrate liquid processing apparatus and substrate liquid processing method29 Sep 2026US 12,747,504 B2Tokyo Electron Limited
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Method of training neural network model, and plating apparatus17 Sep 2026US 2026/0277174 A1Ebara Corporation
- Metal substrate and surface treatment method10 Sep 2026US 2026/0265919 A1National Tsing Hua University
- Laminate and method for manufacturing circuit board27 Aug 2026US 2026/0255493 A1Arisawa Mfg.Co., Ltd.
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995