Substrate liquid processing method and substrate liquid processing apparatus
AssigneeTokyo Electron Limited
InventorsYuki FUJII, Keiichi FUJITA
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Abstract
A substrate liquid processing method includes preparing a substrate including a wiring and an insulating film provided on the wiring, the insulating film having a recess extending up to the wiring to expose the wiring; performing a pre-cleaning process to clean, by using a pre-cleaning liquid that does not contain a reducing agent but contains a first metal ion, a surface of the insulating film including a partition surface forming the recess; and performing an electroless plating process to precipitate, by using an electroless plating liquid containing the first metal ion, a plating metal in the recess of the substrate after being subjected to the pre-cleaning process.
Claims20
A substrate liquid processing method, comprising:
- preparing a substrate including a wiring and an insulating film disposed on the wiring, the insulating film having a recess extending up to the wiring to expose the wiring;
- performing a pre-cleaning process to clean, by using a pre-cleaning liquid that does not contain a reducing agent but contains a first metal ion, a surface of the insulating film including a partition surface forming the recess;
- and
- performing an electroless plating process to precipitate, by using an electroless plating liquid containing the first metal ion, a plating metal in the recess of the substrate after being subjected to the pre-cleaning process.
A substrate liquid processing apparatus, comprising:
- a substrate support configured to support a substrate including a wiring and an insulating film disposed on the wiring, the insulating film having a recess extending up to the wiring to expose the wiring;
- a substrate cleaning device configured to perform a pre-cleaning process by supplying a pre-cleaning liquid, which does not contain a reducing agent but contains a first metal ion, to the substrate to clean a surface of the insulting film including a partition surface forming the recess;
- and
- an electroless plating device configured to precipitate a plating metal in the recess of the substrate after being subjected to the pre-cleaning process by supplying an electroless plating liquid containing the first metal ion to the substrate.
Dependencies are inferred from the claim text.