C23C 18/1619
Apparatus for electroless plating
Official title: {Apparatus for electroless plating}
C23C18/1619 (Apparatus for electroless plating) appears on 370 US grants and 474 published applications in this corpus.
Search patents in C23C- Granted patents
- 370
- Published applications
- 474
- Assignees
- 217
- Inventors
- 952
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 4 |
| 2002 | 5 | 5 |
| 2003 | 4 | 15 |
| 2004 | 9 | 26 |
| 2005 | 11 | 37 |
| 2006 | 12 | 29 |
| 2007 | 8 | 22 |
| 2008 | 10 | 15 |
| 2009 | 12 | 12 |
| 2010 | 11 | 17 |
| 2011 | 17 | 19 |
| 2012 | 15 | 16 |
| 2013 | 14 | 13 |
| 2014 | 15 | 31 |
| 2015 | 8 | 28 |
| 2016 | 18 | 25 |
| 2017 | 26 | 26 |
| 2018 | 18 | 16 |
| 2019 | 13 | 24 |
| 2020 | 15 | 15 |
| 2021 | 16 | 18 |
| 2022 | 10 | 24 |
| 2023 | 11 | 15 |
| 2024 | 6 | 14 |
| 2025 | 17 | 5 |
| 2026 | 5 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate liquid processing apparatus and substrate liquid processing method29 Sep 2026US 12,747,504 B2Tokyo Electron Limited
- Method of fabricating semiconductor device using apparatus for supplying supercritical fluids2 Jun 2026US 12,644,188 B2Samsung Electronics Co., Ltd.
- Apparatus for processing substrate, device of controlling apparatus for processing substrate, method of controlling apparatus for processing substrate, and storage medium that stores program7 Apr 2026US 12,598,941 B2Ebara Corporation
- Electroless plating apparatus3 Mar 2026US 12,565,705 B2ASKA CORPORATION Co., Ltd.
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Wet processing device with gas-liquid mixing11 Jun 2026US 2026/0159955 A1Yield Engineering Systems, Inc.
- Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus15 Jan 2026US 2026/0015752 A1Atotech Deutschland GmbH
- Electroless Deposition Process for Semiconductor Devices19 Jun 2025US 2025/0201565 A1Wolfspeed, Inc.
- Electroless Deposition Process for Semiconductor Devices19 Jun 2025US 2025/0201740 A1Wolfspeed, Inc.
Most cited
By later US patents
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Electroless deposition equipment or apparatus and method of performing electroless deposition292US 5,830,805 ACornell Research Foundation, Inc. · 1998
- Modular apparatus and method for surface treatment of parts with liquid baths285US 5,415,890 AEaton Corporation · 1995
- Measurement techniques for controlling aspects of a electroless deposition process232US 7,465,358 B2APPLIED Materials.Inc. · 2008