C23C 18/1632
Features specific for the apparatus
Official title: {Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells}
C23C18/1632 (Features specific for the apparatus) appears on 114 US grants and 153 published applications in this corpus.
Search patents in C23C- Granted patents
- 114
- Published applications
- 153
- Assignees
- 67
- Inventors
- 359
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 2 |
| 2002 | 2 | 2 |
| 2003 | 0 | 9 |
| 2004 | 6 | 10 |
| 2005 | 5 | 12 |
| 2006 | 7 | 8 |
| 2007 | 3 | 5 |
| 2008 | 1 | 5 |
| 2009 | 5 | 1 |
| 2010 | 3 | 6 |
| 2011 | 3 | 3 |
| 2012 | 7 | 4 |
| 2013 | 3 | 3 |
| 2014 | 3 | 10 |
| 2015 | 3 | 11 |
| 2016 | 5 | 11 |
| 2017 | 13 | 10 |
| 2018 | 8 | 4 |
| 2019 | 5 | 7 |
| 2020 | 9 | 4 |
| 2021 | 5 | 3 |
| 2022 | 1 | 7 |
| 2023 | 3 | 7 |
| 2024 | 0 | 5 |
| 2025 | 2 | 3 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for processing substrate, device of controlling apparatus for processing substrate, method of controlling apparatus for processing substrate, and storage medium that stores program7 Apr 2026US 12,598,941 B2Ebara Corporation
- Electroless plating apparatus3 Mar 2026US 12,565,705 B2ASKA CORPORATION Co., Ltd.
- Substrate liquid processing apparatus and substrate liquid processing method7 Oct 2025US 12,435,426 B2Tokyo Electron Limited
- Agitation monitoring system for plating process26 Aug 2025US 12,399,006 B2Intel Corporation
- Substrate liquid processing apparatus, substrate liquid processing method and recording medium24 Oct 2023US 11,795,546 B2Tokyo Electron Limited
- Wet processing device with gas-liquid mixing11 Jun 2026US 2026/0159955 A1Yield Engineering Systems, Inc.
- Electroless Deposition Process for Semiconductor Devices19 Jun 2025US 2025/0201565 A1Wolfspeed, Inc.
- Electroless Deposition Process for Semiconductor Devices19 Jun 2025US 2025/0201740 A1Wolfspeed, Inc.
- System and method for performing localized electroless nickel plating13 Feb 2025US 2025/0051926 A1Nuovo Pignone Tecnologie Srl
- Plating method and plating apparatus19 Sep 2024US 2024/0309511 A1Tokyo Electron Limited
Most cited
By later US patents
- Modular apparatus and method for surface treatment of parts with liquid baths285US 5,415,890 AEaton Corporation · 1995
- Manufacturing computer systems with fine line circuitized substrates71US 6,268,016 B1International Business Machines Corporation · 2001
- Apparatus for multi-phase fluid systems66US 4,090,530 AHooker Chemicals & Plastics Corporation · 1978
- Process and apparatus for plating onto articles58US 4,576,685 ASchering Corporation · 1986
- Electroless plating method and apparatus41US 4,894,260 APioneer Electronic Corporation · 1990